SNVSBF6B October 2019 – December 2020 TPSM265R1
PRODUCTION DATA
The amount of PCB copper affects the thermal performance of the device. Figure 10-3 shows the effects of copper area on the junction-to-ambient thermal resistance (RθJA) of the TPSM265R1. The junction-to-ambient thermal resistance is plotted for a 4-layer PCB with an area from 0.5 cm2 to 39 cm2.
To determine the required copper area for an application: