SBOSAL6A June   2025  – September 2025 XTR200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Using an External Transistor
      3. 6.3.3 Error Flag
    4. 6.4 Device Functional Modes
      1. 6.4.1 Current-Output Mode
      2. 6.4.2 Voltage-Output Mode
      3. 6.4.3 Output Disabled
      4. 6.4.4 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Miswiring Protection
      3. 7.1.3 Power Dissipation in Current Output Mode
      4. 7.1.4 Estimating Junction Temperature
    2. 7.2 Typical Applications
      1. 7.2.1 Analog Output Circuit for Field Transmitters
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1.     53
    2. 10.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.1 Current-Output Mode

Applying a voltage greater than 1.65V to the MODE pin places the XTR200 into current-output mode. In current-output mode, the XTR200 acts as a voltage-controlled current source. Figure 6-3 shows the internal configuration of the XTR200, as well as the current flow inside the device. When a voltage is applied to the input, amplifier A1 drives the gate of NMOS transistor Q1, which causes a current ISET to flow through the external resistor RSET. The voltage at the SET pin is fed back to the inverting input of amplifier A1 through switch SW1. This feedback loop forces the voltage at the SET pin to equal the input voltage, as shown in Equation 1.

Equation 1. ISET=VINRSET

ISET also flows through the 500Ω resistor connected between the drain of Q1 and the power supply, VSP. Amplifier A2 senses the voltage drop across this 500Ω resistor and drives the gate of the PMOS output transistor Q2 through switch SW4. This action creates an equal voltage drop across the 50Ω resistor at the inverting input connected between the source of Q2 and VSP. To produce an equal voltage at the input terminals of amplifier A2, 10 times more current must flow through the 50Ω resistor, as shown in Equation 2

Equation 2. IOUT=10×ISET

The general equation for the transfer function in current-output mode is:

Equation 3. IOUT=10×VINRSET
XTR200 XTR200 Internal Configuration and Current Flow in Current-Output ModeFigure 6-3 XTR200 Internal Configuration and Current Flow in Current-Output Mode