SBOSAL6A June   2025  – September 2025 XTR200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Using an External Transistor
      3. 6.3.3 Error Flag
    4. 6.4 Device Functional Modes
      1. 6.4.1 Current-Output Mode
      2. 6.4.2 Voltage-Output Mode
      3. 6.4.3 Output Disabled
      4. 6.4.4 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Miswiring Protection
      3. 7.1.3 Power Dissipation in Current Output Mode
      4. 7.1.4 Estimating Junction Temperature
    2. 7.2 Typical Applications
      1. 7.2.1 Analog Output Circuit for Field Transmitters
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1.     53
    2. 10.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.1.2 Detailed Design Procedure

The only calculation required to complete the circuit design is a single external component, RSET. Resistor RSET determines the voltage-to-current transfer function of the circuit. The value of RSET is calculated using the maximum input voltage and the maximum output current as shown in Equation 10.

Equation 10. RSET=10×VIN(MAX)IOUT(MAX)=10×3V22mA=1363.64Ω→1.33kΩ

A value of 1.33kΩ is chosen for RSET as this is a standard 1% resistor value that is very close to the calculated value of 1363.64Ω and can still provide the required maximum output current of 22mA. Select a resistor with a low temperature coefficient and tight value tolerance to minimize the error introduced by this external component.

No calculations are required to set the output voltage transfer function. The XTR200 has a fixed gain of 3.75V/V in voltage-output mode which is sufficient for a variety of DAC output voltage ranges.

Consider the headroom requirement of the XTR200 when evaluating the load resistance and power supply voltage ranges. The worst case scenario is a minimum supply voltage of 18V and the maximum output current (22mA) into the maximum load resistor (500Ω). In this case, the load voltage is 11V and the headroom (the difference between supply voltage and load voltage) is 7V. This case is well above the 2.5V headroom requirement of the XTR200 and sufficient for proper operation. The required maximum power supply voltage, 36V, is well within the limits recommended in Power Supply Recommendations when using the internal transistor.

Figure 7-7 also shows a 0.1μF bypass capacitor, CBYP, on the power supply pin, VSP, of the XTR200. The bypass capacitor location is a good design practice and helps provide a low-impedance supply for the XTR200 and filter out any residual noise on the power supply.