SBOSAL6A June   2025  – September 2025 XTR200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Using an External Transistor
      3. 6.3.3 Error Flag
    4. 6.4 Device Functional Modes
      1. 6.4.1 Current-Output Mode
      2. 6.4.2 Voltage-Output Mode
      3. 6.4.3 Output Disabled
      4. 6.4.4 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Miswiring Protection
      3. 7.1.3 Power Dissipation in Current Output Mode
      4. 7.1.4 Estimating Junction Temperature
    2. 7.2 Typical Applications
      1. 7.2.1 Analog Output Circuit for Field Transmitters
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1.     53
    2. 10.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Power Supply Recommendations

The XTR200 operates over a supply voltage range of 8V to 60V. However, consider the environmental temperature, load current, and load resistance in the overall system design. Figure 7-15 shows the thermally-limited maximum supply voltage of the XTR200 over a range of PCB temperatures. Figure 7-15 shows a worst-case scenario of 22mA output current into a 0Ω load using the internal output transistor, IS and VG pins shorted.

The black curve shows the supply voltage resulting in a 125°C junction temperature (the maximum specified temperature of the XTR200) for the given PCB temperature. The red curve shows the supply voltages resulting in a 150°C junction temperature (maximum operating temperature of the XTR200) for a given PCB temperature. At approximately 150°C, the Error Flag pin (EF) voltage goes low, warning of high junction temperature.

The XTR200 thermal shutdown circuitry disables the output for junction temperatures above 160°C. When the junction temperature falls back below 150°C, the output is re-enabled. For PCB temperatures below 70°C, the maximum recommended supply voltage is limited by the voltage rating of the XTR200 internal circuitry rather than thermal considerations. If high-temperature and high-supply-voltage operation is required, use an external transistor to deliver the load current as described in Using an External Transistor.

XTR200 Maximum Recommended Supply Voltage vs PCB Temperature (Internal Output Transistor)Figure 7-15 Maximum Recommended Supply Voltage vs PCB Temperature (Internal Output Transistor)

Consider the headroom specification of the XTR200 when determining the working power supply range of a system. The term headroom defines the difference between the supply voltage of the XTR200 and the load voltage as shown in Figure 7-16. Above the minimum supply voltage, 8V, confirm that the XTR200 supply voltage is at least 2.5V above the load voltage.

XTR200 XTR200 HeadroomFigure 7-16 XTR200 Headroom