JAJSLB2E November   2014  – May 2025 DLP9500UV

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 説明
  5. 概要 (続き)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  LVDS Timing Requirements
    8. 6.8  LVDS Waveform Requirements
    9. 6.9  Serial Control Bus Timing Requirements
    10. 6.10 Systems Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Chipset Component Usage Specification
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DLPC410—Digital Controller for DLP Discovery 4100 Chipset
      2. 7.3.2 DLPA200 - DMD Micromirror Drivers
      3. 7.3.3 DLPR410—PROM for DLP Discovery 4100 Chipset
      4. 7.3.4 DLP9500—DLP 0.95 1080p 2xLVDS UV Type-A DMD 1080p DMD
        1. 7.3.4.1 DLP9500UV 1080p Chipset Interfaces
          1. 7.3.4.1.1 DLPC410 Interface Description
            1. 7.3.4.1.1.1 DLPC410 IO
            2. 7.3.4.1.1.2 Initialization
            3. 7.3.4.1.1.3 DMD Device Detection
            4. 7.3.4.1.1.4 Power Down
          2. 7.3.4.1.2 DLPC410 to DMD Interface
            1. 7.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 7.3.4.1.2.2 Data Flow
          3. 7.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 7.3.4.1.3.1 DLPA200 Operation
            2. 7.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 7.3.4.1.4 DLPA200 to DLP9500UV Interface
            1. 7.3.4.1.4.1 DLPA200 to DLP9500UV Interface Overview
      5. 7.3.5 Measurement Conditions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single Block Mode
      2. 7.4.2 Dual Block Mode
      3. 7.4.3 Quad Block Mode
      4. 7.4.4 Global Block Mode
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Package Thermal Resistance
      2. 7.6.2 Case Temperature
      3. 7.6.3 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On and Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DMD Reflectivity Characteristics
        1. 8.1.1.1 Design Considerations Influencing DMD Reflectivity
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Device Description
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Up Sequence (Handled by the DLPC410)
      2. 8.3.2 DMD Power-Up and Power-Down Procedures
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Impedance Requirements
        2. 8.4.1.2 PCB Signal Routing
        3. 8.4.1.3 Fiducials
        4. 8.4.1.4 PCB Layout Guidelines
          1. 8.4.1.4.1 DMD Interface
            1. 8.4.1.4.1.1 Trace Length Matching
          2. 8.4.1.4.2 DLP9500UV Decoupling
            1. 8.4.1.4.2.1 Decoupling Capacitors
          3. 8.4.1.4.3 VCC and VCC2
          4. 8.4.1.4.4 DMD Layout
          5. 8.4.1.4.5 DLPA200
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Device Marking
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Related Links
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Overview

Optically, the DLP9500UV consists of 2,073,600 highly reflective, digitally switchable, micrometer-sized mirrors (micromirrors), organized in a two-dimensional array of 1920 micromirror columns by 1080 micromirror rows. Each aluminum micromirror is approximately 10.8 microns in size (see the Micromirror Pitch section) and is switchable between two discrete angular positions: –12° and 12°. The angular positions are measured relative to a 0° flat state, which is parallel to the array plane (see Figure 7-6 section). The tilt direction is perpendicular to the hinge axis, which is positioned diagonally relative to the overall array. The On State landed position is directed toward row 0, column 0 (upper left) corner of the device package (see the Micromirror Pitch section). In the field of visual displays, the 1920 × 1080 pixel resolution is referred to as 1080p.

Each individual micromirror is positioned over a corresponding CMOS memory cell. The angular position of a specific micromirror is determined by the binary state (logic 0 or 1) of the corresponding CMOS memory cell contents after the mirror clocking pulse is applied. The angular position (–12° or +12°) of the individual micromirrors changes synchronously with a micromirror clocking pulse, rather than being synchronous with the CMOS memory cell data update. Therefore, writing logic 1 into a memory cell, followed by a mirror clocking pulse, results in the corresponding micromirror switching to a 12° position. Writing a logic 0 into a memory cell, followed by a mirror clocking pulse, results in the corresponding micromirror switching to a –12° position.

Updating the angular position of the micromirror array consists of two steps. First, update the contents of the CMOS memory. Second, the application of a micromirror clocking pulse to all or a portion of the micromirror array (depending upon the configuration of the system). Micromirror clocking pulses are generated externally by two DLPA200s, with the application of the pulses being coordinated by the DLPC410 controller.

Around the perimeter of the 1920 by 1080 array of micromirrors is a uniform band of border micromirrors. The border micromirrors are not user-addressable. The border micromirrors land in the –12° position once power has been applied to the device. There are 10 border micromirrors on each side of the 1920 by 1080 active array.

Figure 7-1 shows a DLPC410 and DLP9500UV chipset block diagram. The DLPC410 and DLPA200s control and coordinate the data loading and micromirror switching for reliable DLP9500UV operation. The DLPR410 is the programmed PROM required to properly configure the DLPC410 controller. For more information on the chipset components, see Section 8. For a typical system application using the DLP Discovery 4100 chipset including a DLP9500UV, see Figure 8-2.