SLAAEO4 November   2025 MSPM0G3507 , MSPM0L1306

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Terminology
  5. 2 NONMAIN Architecture
    1. 2.1 MSPM0 Family Overview
    2. 2.2 NONMAIN Configuration Overview
    3. 2.3 NONMAIN Memory
  6. 3 NONMAIN Configuration
    1. 3.1 BCR Configuration
      1. 3.1.1 BCR Configuration ID
      2. 3.1.2 Serial Wire Debug (SWD) Policy
        1. 3.1.2.1 Access Policy
        2. 3.1.2.2 Debug Policy
          1. 3.1.2.2.1 Plain Text Password Example
          2. 3.1.2.2.2 SHA2-256 Password Example
        3. 3.1.2.3 Mass Erase and Factory Reset Policy
        4. 3.1.2.4 TI Failure Analysis
      3. 3.1.3 Flash Memory Static Write Protection
        1. 3.1.3.1 MAIN Flash Static Write Protection
        2. 3.1.3.2 NONMAIN Flash Static Write Protection
      4. 3.1.4 Customer Secure Code (CSC)
        1. 3.1.4.1 CSC Policy
        2. 3.1.4.2 Flash Bank Swap Policy
        3. 3.1.4.3 Debug Hold
      5. 3.1.5 Fast Boot Mode
      6. 3.1.6 Application Digest Check
        1. 3.1.6.1 CRC32 Digest Check Example
        2. 3.1.6.2 SHA2-256 Digest Check Example
      7. 3.1.7 BSL Policy
      8. 3.1.8 BCR Checksum
        1. 3.1.8.1 CRC Check Fail Handling
    2. 3.2 BSL Configuration
      1. 3.2.1 BSL Configuration ID
      2. 3.2.2 Invoke Pin Configuration
      3. 3.2.3 ROM-Based Communication Interface
        1. 3.2.3.1 UART Interface
        2. 3.2.3.2 I2C Interface
        3. 3.2.3.3 USB Interface
      4. 3.2.4 Flash Plug-in Interface
      5. 3.2.5 Alternative BSL Interface
      6. 3.2.6 BSL Security Configuration
        1. 3.2.6.1 Access Password
        2. 3.2.6.2 Read-Out Feature
        3. 3.2.6.3 Alert Feature
        4. 3.2.6.4 Application Integrity Check
      7. 3.2.7 BSL Checksum
        1. 3.2.7.1 CRC Check Fail Handling
  7. 4 NONMAIN Configuration With SysConfig
    1. 4.1 SysConfig Introduction
    2. 4.2 BCR Configuration with SysConfig
      1. 4.2.1 Password Configuration
      2. 4.2.2 Flash Static Write Protection
      3. 4.2.3 Other BCR Configurations
    3. 4.3 BSL Configuration With SysConfig
      1. 4.3.1 BSL Access Password
      2. 4.3.2 BSL Invoke Pin Configuration
      3. 4.3.3 BSL Communication Interface
      4. 4.3.4 Flash Plug-in Interface
      5. 4.3.5 Alternative BSL Interface
      6. 4.3.6 Other BCR Configurations
  8. 5 NONMAIN Configuration in Application Code
  9. 6 NONMAIN Operation with IDE Tool
    1. 6.1 NONMAIN Configuration Files
    2. 6.2 Project Erase Property
    3. 6.3 Password-Protected Debug
  10. 7 NONMAIN Operation with Programmer Tool
    1. 7.1 NONMAIN Operation with UniFlash
    2. 7.2 NONMAIN Operation with J-Flash
    3. 7.3 NONMAIN Operation with C-GANG
    4. 7.4 NONMAIN Operation with MSP-GANG
  11. 8 Frequently Asked Questions (FAQs)
    1. 8.1 MCU Locked State Analysis
      1. 8.1.1 Hardware Issue Analysis
        1. 8.1.1.1 Hardware Circuit Design
        2. 8.1.1.2 Debugger Connection
        3. 8.1.1.3 External Reset Signal
      2. 8.1.2 Software Issue Analysis
        1. 8.1.2.1 CPU Enters a Fault State
        2. 8.1.2.2 BCR Configuration
        3. 8.1.2.3 Low Power Mode (STOP or STANDBY)
        4. 8.1.2.4 SHUTDOWN IO State
        5. 8.1.2.5 SWD IO Function
        6. 8.1.2.6 WDT or IWDT Reset
        7. 8.1.2.7 Software POR or BOOTRST
    2. 8.2 Unlock the MSPM0 Device
      1. 8.2.1 Force MCU to Enter BSL Mode
      2. 8.2.2 Send BSL Command
      3. 8.2.3 Generate DSSM Command
    3. 8.3 Debug Error Overview
      1. 8.3.1 No Error Code: DAP Connection Error
      2. 8.3.2 No Error Code: Connection to MSPM0 Core Failed
      3. 8.3.3 Error - 6305: PRSC Module Failed to Write a Routine Register
      4. 8.3.4 Error - 260: An Attempt to Connect to the XDS110 Failed
      5. 8.3.5 Error - 261: Invalid Response From the XDS110
      6. 8.3.6 Error - 615: Target Fails to Identify a Correctly Formatted SWD Header
      7. 8.3.7 Error - 1001: Requested Operation is not Supported on This Device
      8. 8.3.8 Error - 2131: Unable to Access Device Register
    4. 8.4 MSPM0 Boot Diagnostic
  12. 9 Summary
  13. 10References

3.1.2.4 TI Failure Analysis

TI failure analysis access is the ability for TI to initiate a failure analysis (FA) return flow through SWD. The TI FA flow always forces a factory reset before FA access is given to TI. This establishes that TI does not have a mechanism to read proprietary customer information stored in the device flash memory when a failure analysis flow is initiated.

Users can disable TI failure analysis using the BOOTCFG1.TI_FA_MODE field. This access prevents TI from performing a factory reset and further FA activities on the device.