SBASAI9 December   2025 ADS122S14

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs and Multiplexer
      2. 7.3.2  Programmable Gain Amplifier (PGA)
      3. 7.3.3  Voltage Reference
        1. 7.3.3.1 Internal Reference
        2. 7.3.3.2 External Reference
        3. 7.3.3.3 Reference Buffers
      4. 7.3.4  Clock Source
      5. 7.3.5  Delta-Sigma Modulator
      6. 7.3.6  Digital Filter
        1. 7.3.6.1 Sinc4 and Sinc4 + Sinc1 Filter
        2. 7.3.6.2 FIR Filter
        3. 7.3.6.3 Digital Filter Latency
        4. 7.3.6.4 Global-Chop Mode
      7. 7.3.7  Excitation Current Sources (IDACs)
      8. 7.3.8  Burn-Out Current Sources (BOCS)
      9. 7.3.9  General Purpose IOs (GPIOs)
        1. 7.3.9.1 FAULT Output
        2. 7.3.9.2 DRDY Output
      10. 7.3.10 System Monitors
        1. 7.3.10.1 Internal Short (Offset Calibration)
        2. 7.3.10.2 Internal Temperature Sensor
        3. 7.3.10.3 External Reference Voltage Readback
        4. 7.3.10.4 Power-Supply Readback
      11. 7.3.11 Monitors and Status Flags
        1. 7.3.11.1 Reset (RESETn flag)
        2. 7.3.11.2 AVDD Undervoltage Monitor (AVDD_UVn flag)
        3. 7.3.11.3 Reference Undervoltage Monitor (REV_UVn flag)
        4. 7.3.11.4 SPI CRC Fault (SPI_CRC_FAULTn flag)
        5. 7.3.11.5 Register Map CRC Fault (REG_MAP_CRC_FAULTn flag)
        6. 7.3.11.6 Internal Memory Fault (MEM_FAULTn flag)
        7. 7.3.11.7 Register Write Fault (REG_WRITE_FAULTn flag)
        8. 7.3.11.8 DRDY Indicator (DRDY bit)
        9. 7.3.11.9 Conversion Counter (CONV_COUNT[3:0])
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-up and Reset
        1. 7.4.1.1 Power-On Reset (POR)
        2. 7.4.1.2 Reset by Register Write
        3. 7.4.1.3 Reset by SPI Input Pattern
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Idle and Standby Mode
        2. 7.4.2.2 Power-Down Mode
        3. 7.4.2.3 Power-Scalable Conversion Modes
          1. 7.4.2.3.1 Continuous-Conversion Mode
          2. 7.4.2.3.2 Single-shot Conversion Mode
    5. 7.5 Programming
      1. 7.5.1  Serial Interface (SPI)
      2. 7.5.2  Serial Interface Signals
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output/Data Ready (SDO/DRDY)
        5. 7.5.2.5 Data Ready (DRDY) Pin
      3. 7.5.3  Serial Interface Communication Structure
        1. 7.5.3.1 SPI Frame
        2. 7.5.3.2 STATUS Header
        3. 7.5.3.3 SPI CRC
      4. 7.5.4  Device Commands
        1. 7.5.4.1 No Operation (Read Conversion Data)
        2. 7.5.4.2 Read Register Command
        3. 7.5.4.3 Write Register Command
      5. 7.5.5  Continuous-Read Mode
        1. 7.5.5.1 Read Registers in Continuous-Read Mode
      6. 7.5.6  Daisy-Chain Operation
      7. 7.5.7  3-Wire SPI Mode
        1. 7.5.7.1 3-Wire SPI Mode Frame Re-Alignment
      8. 7.5.8  Monitoring for New Conversion Data
        1. 7.5.8.1 DRDY Pin or SDO/DRDY Pin Monitoring
        2. 7.5.8.2 Reading DRDY Bit and Conversion Counter
        3. 7.5.8.3 Clock Counting
      9. 7.5.9  DRDY Pin Behavior
      10. 7.5.10 Conversion Data Format
      11. 7.5.11 Register Map CRC
  9. 8 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Interfacing with Multiple Devices
      3. 9.1.3 Unused Inputs and Outputs
      4. 9.1.4 Device Initialization
    2. 9.2 Typical Applications
      1. 9.2.1 Software-Configurable RTD Measurement Input
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Performance Plots
        4. 9.2.1.4 Design Variant – 3-Wire RTD Measurement With Automatic Lead-Wire Compensation Using Two IDACs
      2. 9.2.2 Thermocouple Measurement With Cold-Junction Compensation Using a 2-wire RTD
      3. 9.2.3 Resistive Bridge Sensor Measurement With Temperature Compensation
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supplies
      2. 9.3.2 Power-Supply Sequencing
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1 Layout Guidelines

The following basic recommendations for the ADS1x2S14 layout help achieve the best possible performance of the ADC.

  • For best performance, dedicate an entire PCB layer to a ground plane and do not route any other signal traces on this layer.
  • Use ceramic capacitors (for example, X7R grade) for the power-supply decoupling capacitors. High-K capacitors (Y5V) are not recommended. Place the required capacitors as close as possible to the device pins using short, direct traces. Placing the bypass capacitors on the same layer as close to the device yields the best results.
  • Route digital traces away from all analog inputs and associated components to minimize interference.
  • Provide good ground return paths. Signal return currents flow on the path of least impedance. If the ground plane is cut or has other traces that block the current from flowing right next to the signal trace, another path must be found to return to the source and complete the circuit. If forced into a larger path, the chance that the signal radiates increases. Sensitive signals are more susceptible to EMI interference.
  • Consider the resistance and inductance of the routing. Often, traces for the inputs have resistances that react with the input bias current and cause an added error voltage. Reducing the loop area enclosed by the source signal and the return current reduces the inductance in the path. Reducing the inductance reduces the EMI pickup and reduces the high-frequency impedance at the input of the device.
  • Watch for parasitic thermocouples in the layout. Dissimilar metals going from each analog input to the sensor can create a parasitic thermocouple that can add an offset to the measurement. Differential inputs must be matched for both the inputs going to the measurement source.
  • Use C0G capacitors for the RC filters on the analog inputs.
  • Fill void areas on signal layers with ground fill.
  • When applying an external clock, be sure the clock is free of overshoot and glitches. A source-termination resistor placed at the clock buffer often helps reduce overshoot. Glitches present on the clock input can lead to noise within the conversion data.