SBOK102 July   2025 INA1H94-SP

 

  1.   1
  2.   2
  3.   Trademarks
  4. 1Overview
  5. 2SEE Mechanisms
  6. 3Irradiation Facilities and Telemetry
  7. 4Test Device and Test Board Information
    1. 4.1 Qualification Circuits and Boards
    2. 4.2 Characterization Devices and Test Board Schematics
  8. 5Results
    1. 5.1 SEL Qualification Results
    2. 5.2 SET Characterization Results: MSU FRIB Linac
    3. 5.3 Analysis
    4. 5.4 Weibull Fit
  9. 6Summary
  10.   A MSU Results Appendix
  11.   B Confidence Interval Calculations
  12.   C References

4 Test Device and Test Board Information

The INA1H94-SP is packaged in an 8-pin CFP package. Figure 4-1 shows the pinout diagram. The package lid was removed to reveal the die face for all heavy ion testing.

INA1H94-SP Pinout Diagram Figure 4-1 INA1H94-SP Pinout Diagram

Each device under test, or DUT, used for single-event effect qualification and characterization was sourced from the same wafer fab and assembly lot, which was used for all INA1H94-SP qualification studies. Across the SEL, SET, and absolute-maximum supply extended SEL characterization tests performed, a total of 12 different devices were evaluated. Some lookahead testing was also performed on units from different wafer fab and assembly lots, with no significant differences observed in the test results.