SBOS258E November 2002 – April 2025 OPA698
PRODUCTION DATA
| THERMAL METRIC(1) | OPA698 | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 118 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 63.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 64.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 14.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 64.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |