SBOS258E November   2002  – April 2025 OPA698

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics VS = ±5V
    6. 6.6 Electrical Characteristics VS = 5V
    7. 6.7 Typical Characteristics: VS = ±5V
    8. 6.8 Typical Characteristics: VS = 5V
  8. 7 Detailed Description
    1. 7.1 Overview
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Output Limiters
      2. 8.1.2  Output Drive
      3. 8.1.3  Thermal Considerations
      4. 8.1.4  Capacitive Loads
      5. 8.1.5  Frequency Response Compensation
      6. 8.1.6  Pulse Settling Time
      7. 8.1.7  Distortion
      8. 8.1.8  Noise Performance
      9. 8.1.9  DC Accuracy and Offset Control
      10. 8.1.10 Input and ESD Protection
    2. 8.2 Typical Applications
      1. 8.2.1  Wideband Voltage-Limiting Operation
      2. 8.2.2  Single-Supply, Noninverting Amplifier
      3. 8.2.3  Wideband Inverting Operation
      4. 8.2.4  Limited Output, ADC Input Driver
        1. 8.2.4.1 Limited-Output, Differential ADC Input Driver
        2. 8.2.4.2 Precision Half-Wave Rectifier
      5. 8.2.5  High-Speed Full-Wave Rectifier
        1. 8.2.5.1 High-Speed Full-Wave Rectifier #1
        2. 8.2.5.2 High-Speed Full-Wave Rectifier #2
      6. 8.2.6  Soft-Clipping (Compression) Circuit
      7. 8.2.7  Very High-Speed Schmitt Trigger
      8. 8.2.8  Unity-Gain Buffer
      9. 8.2.9  DC Restorer
      10. 8.2.10 Video Sync Stripper
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Demonstration Fixture
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision D (December 2008) to Revision E (April 2025)

  • Updated Features, Applications, and Description sections and with die redesign specifications; for updated specifications, see the Specifications sectionGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Pin Configuration and Functions Go
  • Changed the supply voltage specification from ±6.5V to 13V in Absolute Maximum Ratings Go
  • Updated the table note in Absolute Maximum Ratings to add clarificationGo
  • Added Supply turn-on and turn-off rate and Continuous input current to Absolute Maximum Ratings Go
  • Deleted soldering flow specification from Absolute maximum  specifications Go
  • Deleted machine model (MM) specification from ESD Ratings Go
  • Added Recommended Operating Conditions Go
  • Deleted minimum and overtemperature specifications in both Electrical Characteristics AC Performance Go
  • Updated test conditions to both Electrical Characteristics for added clarityGo
  • Updated table format for both Electrical Characteristics Go
  • Deleted TA = 0°C to +70°C specifications from all Electrical Characteristics Go
  • Deleted Test Level column from all Electrical Characteristics Go
  • Changed SSBW at G = 1V/V from 450MHz to 650MHzGo
  • Added TA = 25°C to the default test conditions to both Electrical Characteristics.Go
  • Updated AC Performance section with improved typical small  signal bandwidth, slew rate, voltage noise, current noise, and distortion values in both Electrical Characteristics Go
  • Changed Gain bandwidth product from 250MHz to 300MHzGo
  • Changed typical Peaking at a gain of 1V/V from 5dB to 1.5dBGo
  • Changed typical Slew rate from 1100V/µs to 1800V/µsGo
  • Changed Rise and fall time at VO = 0.2V Step from 1.6ns to 1.4nsGo
  • Changed Settling time from 8ns to 25nsGo
  • Changed typical 2nd-order harmonic distortion at RL = 500Ω from –74dBc to –94dBcGo
  • Deleted Differential gain and Differential phase specificationsGo
  • Changed typical 3rd-order harmonic distortion at RL = 500Ω from –87dBc to –85dBcGo
  • Changed typical Open-loop voltage gain from 63dB to 80dBGo
  • Changed typical Input bias current from 3µA to ±0.2µA and Input offset current from ±0.3µA to ±0.1µAGo
  • Changed typical Common-mode rejection ratio from 61dB to 82dBGo
  • Changed Input impedance Differential-mode  from 0.32 || 1MΩ || pF to 1 || 0.3MΩ || pFGo
  • Changed the typical Input impedance common-mode from 3.5 || 1MΩ || pF to 33 || 1.4MΩ || pFGo
  • Changed Current output sourcing and sinking from 120mA and –120mA to +190mA and –190mAGo
  • Changed maximum Limiter input bias current magnitude, TA = –40°C to +85°C from 64µA to 65µAGo
  • Changed the typical Limiter input impedance  from 3.4 || 1 MΩ || pF to 10 || 0.85 MΩ || pFGo
  • Changed typical Limiter feedthrough from –68dB to –95dBGo
  • Changed typical Limiter offset ±5mV from ±10mVGo
  • Changed Op amp input bias current shift from 3µA to 0.15µAGo
  • Changed Limiter small signal bandwidth from 600MHz to 700MHzGo
  • Changed Limiter slew rate from 125V/µs to 175V/µs Go
  • Changed maximum and minimum Quiescent current from 15.9mA to 17.3mA and 15.2mA to 13.8mAGo
  • Changed minimum and maximum Quiescent current, TA = –40°C to +85°C from 16.6mA to 17.7mA and 14.6mA to 13.4mAGo
  • Changed typical Power-supply rejection ratio from 75dB to 90dBGo
  • Moved Thermal Characteristics to Thermal Information table and Recommended Operating Conditions tableGo
  • Changed SSBW at G = 1V/V from 375MHz to 550MHzGo
  • Changed Gain bandwidth product from 230MHz to 300MHzGo
  • Changed typical Bandwidth for 0.1dB gain flatness typical value from 30MHz to 26MHzGo
  • Changed typical Peaking at a gain of 1V/V from 7dB to 2.5dBGo
  • Changed Rise and fall time at VO = 0.2V step from 1.9ns to 1.4nsGo
  • Changed Settling time from 12ns to 28nsGo
  • Changed typical 2nd-order harmonic distortion at RL = 500Ω from 69dBc to –95dBcGo
  • Changed typical 3rd-order harmonic distortion at RL = 500Ω from 73dBc to –81dBcGo
  • Changed the typical Input voltage noise from 5.7nV/√Hz to 4nV/√HzGo
  • Changed the typical Input current noise from 2.3pA/√Hz to 1.4pA/√HzGo
  • Changed typical Open-loop voltage gain from 60dB to 77dBGo
  • Changed typical Input bias current from ±3μA to ±0.5μA and Input offset current from ±0.4μA to ±0.1μAGo
  • Changed typical Common-mode rejection ratio from 58dB to 82dBGo
  • Changed Input impedance Differential-mode from 0.32 || 1 MΩ || pF to 0.77 || 0.3 MΩ || pFGo
  • Changed the typical Input impedance common-mode from 3.5 || 1 MΩ || pF to 24 || 1.5MΩ || pFGo
  • Changed Current output Sourcing and sinking from 70mA and –70mA to 170mA and –170mAGo
  • Changed the typical closed-loop output impedance from 0.2Ω to 0.1ΩGo
  • Changed  Limiter Input Bias Current Magnitude from 16µA to 8µAGo
  • Changed Limiter input impedance from 3.4 || 1 MΩ || pF to 1 || 7 MΩ || pFGo
  • Changed typical Limiter feedthrough from –60dB to –92dBGo
  • Deleted Bias current shift specificationGo
  • Changed Limiter small signal bandwidth from 450MHz to 515MHzGo
  • Changed Limiter slew rate from 100V/μs to 150V/μsGo
  • Changed Limited step response overshoot from 55mV to 40mVGo
  • Changed Limited step response recovery time from  3ns to 2.5nsGo
  • Changed maximum Quiescent current from 14.9mA to 17.2mAGo
  • Changed typical quiescent current from 14.3mA to 15.6mAGo
  • Changed maximum quiescent current, TA = –40°C to +85°C from 15.3mA to 17.6mAGo
  • Changed typical Power-supply rejection ratio from 70dB to 85dBGo
  • Updated Typical Characteristics: VS = ±5V with new die characteristicsGo
  • Updated Typical Characteristics: VS = 5V with new die characteristicsGo
  • Updated Typical Application with data from Electrical and Typical Characteristics Go

Changes from Revision C (March 2006) to Revision D (December 2008)

  • Changed minimum Storage temperature range from −40°C to −65°C.Go

Changes from Revision B (September 2003) to Revision C (March 2006)

  • Changed board part number in the Demonstration Fixture sectionGo