SCDS453E
June 2024 – October 2025
TMUXS7614D
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Thermal Information
5.4
Recommended Operating Conditions
5.5
Source or Drain Current through Switch
5.6
Electrical Characteristics (Global)
5.7
Electrical Characteristics (±15V Dual Supply)
5.8
Switching Characteristics (±15V Dual Supply)
5.9
Electrical Characteristics (±20V Dual Supply)
5.10
Switching Characteristics (±20V Dual Supply)
5.11
Electrical Characteristics (+37.5V/–12.5V Dual Supply)
5.12
Switching Characteristics (+37.5V/–12.5V Dual Supply)
5.13
Electrical Characteristics (12V Single Supply)
5.14
Switching Characteristics (12V Single Supply)
5.15
SPI Timing Characteristics (2.7V to 5.5V)
5.16
SPI Timing Characteristics (1.8V to 2.7V)
5.17
Timing Diagrams
5.18
Typical Characteristics
6
Parameter Measurement Information
6.1
On-Resistance
6.2
Off-Leakage Current
6.3
On-Leakage Current
6.4
tON and tOFF Time
6.5
Break-Before-Make
6.6
Charge Injection
6.7
Off Isolation
6.8
Channel-to-Channel Crosstalk
6.9
Bandwidth
6.10
THD + Noise
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Bidirectional Operation
7.3.2
Rail-to-Rail Operation
7.3.3
1.8V Logic Compatible Inputs
7.3.4
Flat On-Resistance
7.3.5
Power-Up Sequence Free
7.4
SPI Operation
7.4.1
Address Mode
7.4.2
Burst Mode
7.4.3
Daisy Chain Mode
7.4.4
Error Detection
7.4.4.1
Address R/W Error Flag
7.4.4.2
SCLK Count Error Flag
7.4.4.3
CRC (Cyclic Redundancy Check) Enable and Error Flag
7.4.4.4
Clearing Error Flags
7.4.5
Software Reset
7.5
Device Functional Modes
7.6
Register Map
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Recommended Reflow Profile
8.4
Thermal Considerations
8.5
Power Supply Recommendations
8.6
Layout
8.6.1
Layout Guidelines
8.6.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Tape and Reel Information
11.2
Mechanical Data
1
Features
Dual supply range: ±4.5V to
±25V
Single supply range: 4.5V to
42V
Asymmetric dual supply support (For example: V
DD
=37.5V, V
SS
=-12.5V)
1.8V logic compatible
SPI supply range:
1.8V – 5.5V
SPI Interface with support up to 50MHz
Manual mode (Standard SPI or Burst mode)
Section 7.4.3
SPI error detection: CRC, invalid read/write, and clock count error
Compatible with SPI industry standard modes 0 and 3
Ultra high channel density (2.5mm
2
/ch)
Flow through SPI and supply routing for increased board density
Integrated decoupling capacitors
Precision performance:
Low on-resistance: 1Ω (typical)
Ultra low on-resistance flatness
: 0.001Ω (typical)
Low on-leakage current: 13pA (typical), 350pA (maximum)
Ultra low charge injection: 2pC (typical)
High current support: 470mA per channel (maximum)
–40°C to +125°C operating temperature
Rail-to-rail operation
Bidirectional operation
Break-before-make switching
ESD protection HBM: 3000V