SCDS453E June   2024  – October 2025 TMUXS7614D

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Source or Drain Current through Switch
    6. 5.6  Electrical Characteristics (Global)
    7. 5.7  Electrical Characteristics (±15V Dual Supply)
    8. 5.8  Switching Characteristics (±15V Dual Supply)
    9. 5.9  Electrical Characteristics (±20V Dual Supply)
    10. 5.10 Switching Characteristics (±20V Dual Supply)
    11. 5.11 Electrical Characteristics (+37.5V/–12.5V Dual Supply)
    12. 5.12 Switching Characteristics (+37.5V/–12.5V Dual Supply)
    13. 5.13 Electrical Characteristics (12V Single Supply)
    14. 5.14 Switching Characteristics (12V Single Supply)
    15. 5.15 SPI Timing Characteristics (2.7V to 5.5V)
    16. 5.16 SPI Timing Characteristics (1.8V to 2.7V)
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  tON and tOFF Time
    5. 6.5  Break-Before-Make
    6. 6.6  Charge Injection
    7. 6.7  Off Isolation
    8. 6.8  Channel-to-Channel Crosstalk
    9. 6.9  Bandwidth
    10. 6.10 THD + Noise
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail-to-Rail Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Flat On-Resistance
      5. 7.3.5 Power-Up Sequence Free
    4. 7.4 SPI Operation
      1. 7.4.1 Address Mode
      2. 7.4.2 Burst Mode
      3. 7.4.3 Daisy Chain Mode
      4. 7.4.4 Error Detection
        1. 7.4.4.1 Address R/W Error Flag
        2. 7.4.4.2 SCLK Count Error Flag
        3. 7.4.4.3 CRC (Cyclic Redundancy Check) Enable and Error Flag
        4. 7.4.4.4 Clearing Error Flags
      5. 7.4.5 Software Reset
    5. 7.5 Device Functional Modes
    6. 7.6 Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Recommended Reflow Profile
    4. 8.4 Thermal Considerations
    5. 8.5 Power Supply Recommendations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

5.3 Thermal Information

THERMAL METRIC(1) TMUXS7614D UNIT
ZEM (LGA)
30 PINS
RθJA Junction-to-ambient thermal resistance 53.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.9 °C/W
RθJB Junction-to-board thermal resistance 28.2 °C/W
ΨJT Junction-to-top characterization parameter 0.30 °C/W
ΨJB Junction-to-board characterization parameter 27.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 41.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.