SLASFJ6A July   2025  – September 2025 MSPM0C1105 , MSPM0C1106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
      4. 7.9.4 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Electrical Characteristics
      2. 7.14.2 Voltage Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 I2C
      1. 7.16.1 I2C Characteristics
      2. 7.16.2 I2C Filter
      3. 7.16.3 I2C Timing Diagram
    17. 7.17 SPI
      1. 7.17.1 SPI
      2. 7.17.2 SPI Timing Diagram
    18. 7.18 UART
    19. 7.19 TIMx
    20. 7.20 Emulation and Debug
      1. 7.20.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 Low-Frequency Sub System (LFSS)
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 Security
    19. 8.19 CRC
    20. 8.20 UART
    21. 8.21 I2C
    22. 8.22 SPI
    23. 8.23 IWDT
    24. 8.24 WWDT
    25. 8.25 RTC_B
    26. 8.26 Timers (TIMx)
    27. 8.27 Device Analog Connections
    28. 8.28 Input/Output Diagrams
    29. 8.29 Serial Wire Debug Interface
    30. 8.30 DEBUGSS
    31. 8.31 Device Factory Constants
    32. 8.32 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Device Comparison

Table 5-1 Device Comparison Table
DEVICE NAME (1) FLASH / SRAM (KB)

ADC CHANNEL

UART / I2C / SPI

 TIMG

TIMA

GPIO

COMP

 PACKAGE (2)
MSPM0C1106SPTR 64 / 8 27

3 /2 / 1

4

1

45

1

 48 LQFP
(9mm × 9mm)
MSPM0C1105SPTR 32 / 8
MSPM0C1106SRGZR 64 / 8 27

3 /2 / 1

4

1

45

1

 48 VQFN
(7mm × 7mm)
MSPM0C1105SRGZR (3) 32 / 8

MSPM0C1106SZCMR (3)

 64 / 8 27

3 /2 / 1

4

1

45

1

 48 NFBGA
(3.5mm × 3.5mm)

MSPM0C1105SZCMR (3)

 32 / 8
MSPM0C1106SRHBR 64 / 8 18

3 /2 / 1

4

1

 29 1 32 VQFN
(5mm × 5mm)
MSPM0C1105SRHBR 32 / 8
MSPM0C1106SDGS28R 64 / 8 15

3 /2 / 1

4

1

 25 1 28 VSSOP
(7.1mm × 4.9mm)
MSPM0C1105SDGS28R 32 / 8
MSPM0C1106SRGER 64 / 8 13

3 /2 / 1

4

1

 21 1 24 VQFN
(4mm × 4mm)
MSPM0C1105SRGER 32 / 8
MSPM0C1106SDGS20R 64 / 8 12

3 /2 / 1

4

1

 17 1 20 VSSOP
(5.1mm × 4.9mm)
MSPM0C1105SDGS20R 32 / 8
MSPM0C1106SRUKR 64 / 8 12

3 /2 / 1

4

1

 17 1 20 WQFN
(3mm × 3mm)
MSPM0C1105SRUKR 32 / 8
MSP32C031C6SPTR 32 / 8 27

3 /2 / 1

4

1

 45 1 48 LQFP
(9mm × 9mm)
MSP32G031C6SPTR 32 / 8
MSP32G031C8SPTR 64 / 8
MSP32G031K6SVFCR (3) 32 / 8 18

3 /2 / 1

4

1

 29 1 32 LQFP
(9mm × 9mm)
MSP32C031K6SVFCR (3) 32 / 8
MSP32G031K8SVFCR (3) 64 / 8
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum, or see the TI website.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data.
(3) 32-pin LQFP (VFC) and 48-pin NFBGA (ZCM) are preview