SLDS216B December   2017  – February 2025 PGA302

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Overvoltage and Reverse Voltage Protection
    6. 5.6  Linear Regulators
    7. 5.7  Internal Reference
    8. 5.8  Internal Oscillator
    9. 5.9  Bridge Sensor Supply
    10. 5.10 Temperature Sensor Supply
    11. 5.11 Bridge Offset Cancel
    12. 5.12 P Gain and T Gain Input Amplifiers (Chopper Stabilized)
    13. 5.13 Analog-to-Digital Converter
    14. 5.14 Internal Temperature Sensor
    15. 5.15 Bridge Current Measurement
    16. 5.16 One Wire Interface
    17. 5.17 DAC Output
    18. 5.18 DAC Gain for DAC Output
    19. 5.19 Non-Volatile Memory
    20. 5.20 Diagnostics - PGA30x
    21. 5.21 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Overvoltage and Reverse Voltage Protection
      2. 6.3.2  Linear Regulators
      3. 6.3.3  Internal Reference
      4. 6.3.4  Internal Oscillator
      5. 6.3.5  VBRGP and VBRGN Supply for Resistive Bridge
      6. 6.3.6  ITEMP Supply for Temperature Sensor
      7. 6.3.7  P Gain
      8. 6.3.8  T Gain
      9. 6.3.9  Bridge Offset Cancel
      10. 6.3.10 Analog-to-Digital Converter
        1. 6.3.10.1 Sigma Delta Modulator for ADC
        2. 6.3.10.2 Decimation Filter for ADC
        3. 6.3.10.3 Internal Temperature Sensor ADC Conversion
        4. 6.3.10.4 ADC Scan Mode
          1. 6.3.10.4.1 P-T Multiplexer Timing in Auto Scan Mode
      11. 6.3.11 Internal Temperature Sensor
      12. 6.3.12 Bridge Current Measurement
      13. 6.3.13 Digital Interface
      14. 6.3.14 OWI
        1. 6.3.14.1 Overview of OWI Interface
        2. 6.3.14.2 Activating and Deactivating the OWI Interface
          1. 6.3.14.2.1 Activating OWI Communication
          2. 6.3.14.2.2 Deactivating OWI Communication
        3. 6.3.14.3 OWI Protocol
          1. 6.3.14.3.1 OWI Frame Structure
            1. 6.3.14.3.1.1 Standard field structure:
            2. 6.3.14.3.1.2 Frame Structure
            3. 6.3.14.3.1.3 Sync Field
            4. 6.3.14.3.1.4 Command Field
            5. 6.3.14.3.1.5 Data Field(s)
          2. 6.3.14.3.2 OWI Commands
            1. 6.3.14.3.2.1 OWI Write Command
            2. 6.3.14.3.2.2 OWI Read Initialization Command
            3. 6.3.14.3.2.3 OWI Read Response Command
            4. 6.3.14.3.2.4 OWI Burst Write Command (EEPROM Cache Access)
            5. 6.3.14.3.2.5 OWI Burst Read Command (EEPROM Cache Access)
          3. 6.3.14.3.3 OWI Operations
            1. 6.3.14.3.3.1 Write Operation
            2. 6.3.14.3.3.2 Read Operation
            3. 6.3.14.3.3.3 EEPROM Burst Write
            4. 6.3.14.3.3.4 EEPROM Burst Read
        4. 6.3.14.4 OWI Communication Error Status
      15. 6.3.15 I2C Interface
        1. 6.3.15.1 Overview of I2C Interface
        2. 6.3.15.2 I2C Interface Protocol
        3. 6.3.15.3 Clocking Details of I2C Interface
      16. 6.3.16 DAC Output
      17. 6.3.17 DAC Gain for DAC Output
        1. 6.3.17.1 Connecting DAC Output to DAC GAIN Input
      18. 6.3.18 Memory
        1. 6.3.18.1 EEPROM Memory
          1. 6.3.18.1.1 EEPROM Cache
          2. 6.3.18.1.2 EEPROM Programming Procedure
          3. 6.3.18.1.3 EEPROM Programming Current
          4. 6.3.18.1.4 CRC
      19. 6.3.19 Diagnostics
        1. 6.3.19.1 Power Supply Diagnostics
        2. 6.3.19.2 Sensor Connectivity/Gain Input Faults
        3. 6.3.19.3 Gain Output Diagnostics
        4. 6.3.19.4 PGA302 Harness Open Wire Diagnostics
        5. 6.3.19.5 EEPROM CRC and TRIM Error
      20. 6.3.20 Digital Compensation and Filter
        1. 6.3.20.1 Digital Gain and Offset
        2. 6.3.20.2 TC and NL Correction
        3. 6.3.20.3 Clamping
        4. 6.3.20.4 Filter
      21. 6.3.21 Revision ID
    4. 6.4 Device Functional Modes
  8. 7 Register Maps
    1. 7.1 Programmer's Model
      1. 7.1.1 Memory Map
      2. 7.1.2 Control and Status Registers
        1. 7.1.2.1  MICRO_INTERFACE_CONTROL (DI Page Address = 0x0) (DI Page Offset = 0x0C)
        2. 7.1.2.2  PSMON1 (M0 Address= 0x40000558) (DI Page Address = 0x2) (DI Page Offset = 0x58)
        3. 7.1.2.3  AFEDIAG (M0 Address= 0x4000055A) (DI Page Address = 0x2) (DI Page Offset = 0x5A)
        4. 7.1.2.4  P_GAIN_SELECT (DI Page Address = 0x2) (DI Page Offset = 0x47)
        5. 7.1.2.5  T_GAIN_SELECT (DI Page Address = 0x2) (DI Page Offset = 0x48)
        6. 7.1.2.6  TEMP_CTRL (DI Page Address = 0x2) (DI Page Offset = 0x4C)
        7. 7.1.2.7  OFFSET_CANCEL (DI Page Address = 0x2) (DI Page Offset = 0x4E)
        8. 7.1.2.8  PADC_DATA1 (DI Page Address = 0x0) (DI Page Offset = 0x10)
        9. 7.1.2.9  PADC_DATA2 (DI Page Address = 0x0) (DI Page Offset = 0x11)
        10. 7.1.2.10 TADC_DATA1 (DI Page Address = 0x0) (DI Page Offset = 0x14)
        11. 7.1.2.11 TADC_DATA2 (DI Page Address = 0x0) (DI Page Offset = 0x15)
        12. 7.1.2.12 DAC_REG0_1 (DI Page Address = 0x2) (DI Page Offset = 0x30)
        13. 7.1.2.13 DAC_REG0_2 (DI Page Address = 0x2) (DI Page Offset = 0x31)
        14. 7.1.2.14 OP_STAGE_CTRL (DI Page Address = 0x2) (DI Page Offset = 0x3B)
        15. 7.1.2.15 EEPROM_ARRAY (DI Page Address = 0x5) (DI Page Offset = 0x00 - 0x7F)
        16. 7.1.2.16 EEPROM_CACHE_BYTE0 (DI Page Address = 0x5) (DI Page Offset = 0x80)
        17. 7.1.2.17 EEPROM_CACHE_BYTE1 (DI Page Address = 0x5) (DI Page Offset = 0x81)
        18. 7.1.2.18 EEPROM_PAGE_ADDRESS (DI Page Address = 0x5) (DI Page Offset = 0x82)
        19. 7.1.2.19 EEPROM_CTRL (DI Page Address = 0x5) (DI Page Offset = 0x83)
        20. 7.1.2.20 EEPROM_CRC (DI Page Address = 0x5) (DI Page Offset = 0x84)
        21. 7.1.2.21 EEPROM_STATUS (DI Page Address = 0x5) (DI Page Offset = 0x85)
        22. 7.1.2.22 EEPROM_CRC_STATUS (DI Page Address = 0x5) (DI Page Offset = 0x86)
        23. 7.1.2.23 EEPROM_CRC_VALUE (DI Page Address = 0x5) (DI Page Offset = 0x87)
        24. 7.1.2.24 H0 (EEPROM Address= 0x40000000)
        25. 7.1.2.25 H1 (EEPROM Address= 0x40000002)
        26. 7.1.2.26 H2 (EEPROM Address= 0x40000004)
        27. 7.1.2.27 H3 (EEPROM Address= 0x40000006)
        28. 7.1.2.28 G0 (EEPROM Address= 0x40000008)
        29. 7.1.2.29 G1 (EEPROM Address= 0x4000000A)
        30. 7.1.2.30 G2 (EEPROM Address= 0x4000000C)
        31. 7.1.2.31 G3 (EEPROM Address= 0x4000000E)
        32. 7.1.2.32 N0 (EEPROM Address= 0x40000010)
        33. 7.1.2.33 N1 (EEPROM Address= 0x40000012)
        34. 7.1.2.34 N2 (EEPROM Address= 0x40000014)
        35. 7.1.2.35 N3 (EEPROM Address= 0x40000016)
        36. 7.1.2.36 M0 (EEPROM Address= 0x40000018)
        37. 7.1.2.37 M1 (EEPROM Address= 0x4000001A)
        38. 7.1.2.38 M2 (EEPROM Address= 0x4000001C)
        39. 7.1.2.39 M3 (EEPROM Address= 0x4000001E)
        40. 7.1.2.40 PADC_GAIN (EEPROM Address= 0x40000020)
        41. 7.1.2.41 TADC_GAIN (EEPROM Address= 0x40000021)
        42. 7.1.2.42 PADC_OFFSET (EEPROM Address= 0x40000022)
        43. 7.1.2.43 TADC_OFFSET (EEPROM Address= 0x40000024)
        44. 7.1.2.44 TEMP_SW_CTRL (EEPROM Address= 0x40000028)
        45. 7.1.2.45 DAC_FAULT_MSB (EEPROM Address= 0x4000002A)
        46. 7.1.2.46 LPF_A0_MSB (EEPROM Address= 0x4000002B)
        47. 7.1.2.47 LPF_A1 (EEPROM Address= 0x4000002C)
        48. 7.1.2.48 LPF_A2 (EEPROM Address= 0x4000002E)
        49. 7.1.2.49 .LPF_B1 (EEPROM Address= 0x40000030)
        50. 7.1.2.50 NORMAL_LOW (EEPROM Address= 0x40000032)
        51. 7.1.2.51 NORMAL_HIGH (EEPROM Address= 0x40000034)
        52. 7.1.2.52 LOW_CLAMP (EEPROM Address= 0x40000036)
        53. 7.1.2.53 HIGH_CLAMP (EEPROM Address= 0x40000038)
        54. 7.1.2.54 DIAG_BIT_EN (EEPROM Address= 0x4000003A)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 0-5V Voltage Output
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Application Data
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.10 Temperature Sensor Supply

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ITEMP SUPPLY FOR TEMPERATURE SENSOR(1)
ITEMPCurrent supply to temperature sensorControl bit = 0b000455055µA
Control bit = 0b00190100110
Control bit = 0b010180200220
Control bit = 0b01185010001150
Control bit = 0b1xxOFF
TMISMATCHMismatch between ITEMP temperature variation and ADC reference temperature variationProcedure to calculate drift mismatch:
  1. VDD = 5 V
  2. Connect 1-KΩ, Zero TC resistor to the temperature input pins of device
  3. Set T GAIN = 1.33 V/V
  4. Set ITEMP = 100 µA
  5. Set Temperature = 25°C, Measure ADC Code by averaging 512 samples
  6. Set Temperature = -40°C, Measure ADC Code by averaging 512 samples
  7. Set Temperature = 125°C, Measure ADC Code by averaging 512 samples
  8. Calculate Drift using the formula: (ADC Code at Temperature – ADC Code at 25°C)/((ADC Code at 25°C)×(Temperature – 25))
–250+250ppm/°C
ZOUTOutput ImpedanceEnsured by design15MΩ
CTEMPCapacitive load100nF
(1) Not applicable for 8-pin package options
PGA302 Bridge Supply and ADC Reference are Ratiometric Figure 5-1 Bridge Supply and ADC Reference are Ratiometric