SLLSF09F December   2017  – August 2026 ISO1042

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Transient Immunity
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Ratings
    7. 5.7  Insulation Specifications
    8. 5.8  Safety-Related Certifications
    9. 5.9  Safety Limiting Values
    10. 5.10 Electrical Characteristics - DC Specification
    11. 5.11 Switching Characteristics
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CAN Bus States
      2. 7.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 7.3.3 Protection Features
        1. 7.3.3.1 TXD Dominant Timeout (DTO)
        2. 7.3.3.2 Thermal Shutdown (TSD)
        3. 7.3.3.3 Undervoltage Lockout and Default State
        4. 7.3.3.4 Floating Pins
        5. 7.3.3.5 Unpowered Device
        6. 7.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
        2. 8.2.2.2 CAN Termination
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 DeviceNet Application
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 PCB Material
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.9 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DW-16 PACKAGE
ISSafety input, output, or supply currentRθJA = 69.9°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C, see Figure 5-1325mA
RθJA = 69.9°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C, see Figure 5-1496
RθJA = 69.9°C/W, VI = 2.75V, TJ = 150°C, TA = 25°C, see Figure 5-1650
RθJA = 69.9°C/W, VI = 1.89V, TJ = 150°C, TA = 25°C, see Figure 5-1946
PSSafety input, output, or total powerRθJA = 69.9°C/W, TJ = 150°C, TA = 25°C, see Figure 5-31788mW
TSMaximum safety temperature150°C
DWV-8 PACKAGE
ISSafety input, output, or supply currentRθJA = 100°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C, see Figure 5-2227mA
RθJA = 100°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C, see Figure 5-2347
RθJA = 100°C/W, VI = 2.75V, TJ = 150°C, TA = 25°C, see Figure 5-2454
RθJA = 100°C/W, VI = 1.89V, TJ = 150°C, TA = 25°C, see Figure 5-2661
PSSafety input, output, or total powerRθJA = 100°C/W, TJ = 150°C, TA = 25°C, see Figure 5-41250mW
TSMaximum safety temperature150°C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS must not be exceeded. These limits vary with the ambient temperature, TA. 

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:
TJ = TA + RθJA × P, where P is the power dissipated in the device.
TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.
PS = IS × VI, where VI is the maximum input voltage.