SLLSF09F December   2017  – August 2026 ISO1042

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Transient Immunity
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Ratings
    7. 5.7  Insulation Specifications
    8. 5.8  Safety-Related Certifications
    9. 5.9  Safety Limiting Values
    10. 5.10 Electrical Characteristics - DC Specification
    11. 5.11 Switching Characteristics
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CAN Bus States
      2. 7.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 7.3.3 Protection Features
        1. 7.3.3.1 TXD Dominant Timeout (DTO)
        2. 7.3.3.2 Thermal Shutdown (TSD)
        3. 7.3.3.3 Undervoltage Lockout and Default State
        4. 7.3.3.4 Floating Pins
        5. 7.3.3.5 Unpowered Device
        6. 7.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
        2. 8.2.2.2 CAN Termination
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 DeviceNet Application
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 PCB Material
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

ISO1042 DW Package 16-Pin SOIC Top ViewFigure 4-1 DW Package 16-Pin SOIC Top View
PIN TYPE(1) DESCRIPTION
NO. NAME
1 VCC1 — Digital-side supply voltage, Side 1
2 GND1 — Digital-side ground connection, Side 1
3 TXD I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
4 NC — Not connected
5 RXD O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
6 NC — Not connected
7 NC — Not connected
8 GND1 — Digital-side ground connection, Side 1
9 GND2 — Transceiver-side ground connection, Side 2
10
11 VCC2 — Transceiver-side supply voltage, Side 2. Must be externally connected to pin 16.
12 CANL I/O Low-level CAN bus line
13 CANH I/O High-level CAN bus line
14 NC — Not connected
15 GND2 — Transceiver-side ground connection, Side 2
16 VCC2 — Transceiver-side supply voltage, Side 2. Must be externally connected to pin 11.
(1) I = Input; O = Output; I/O = Input or Output
ISO1042 DWV Package 8-Pin SOIC Top View Figure 4-2 DWV Package 8-Pin SOIC Top View
PIN TYPE(1) DESCRIPTION
NO. NAME
1 VCC1 — Digital-side supply voltage, Side 1
2 TXD I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
3 RXD O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
4 GND1 — Digital-side ground connection, Side 1
5 GND2 — Transceiver-side ground connection, Side 2
6 CANL I/O Low-level CAN bus line
7 CANH I/O High-level CAN bus line
8 VCC2 — Transceiver-side supply voltage, Side 2
(1) I = Input; O = Output; I/O = Input or Output