SLLSF09F December   2017  – August 2026 ISO1042

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Transient Immunity
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Ratings
    7. 5.7  Insulation Specifications
    8. 5.8  Safety-Related Certifications
    9. 5.9  Safety Limiting Values
    10. 5.10 Electrical Characteristics - DC Specification
    11. 5.11 Switching Characteristics
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CAN Bus States
      2. 7.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 7.3.3 Protection Features
        1. 7.3.3.1 TXD Dominant Timeout (DTO)
        2. 7.3.3.2 Thermal Shutdown (TSD)
        3. 7.3.3.3 Undervoltage Lockout and Default State
        4. 7.3.3.4 Floating Pins
        5. 7.3.3.5 Unpowered Device
        6. 7.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
        2. 8.2.2.2 CAN Termination
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 DeviceNet Application
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 PCB Material
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.3.2 Thermal Shutdown (TSD)

If the junction temperature of the device exceeds the thermal shutdown threshold (TTSD), the device turns off the CAN driver circuits, blocking the TXD-to-bus transmission path. The CAN bus terminals are biased to the recessive level during a thermal shutdown, and the receiver-to-RXD path remains operational. The shutdown condition is cleared when the junction temperature drops at least the thermal shutdown hysteresis temperature (TTSD_HYST) below the thermal shutdown temperature (TTSD) of the device.