SLLSFS6B September   2024  – October 2025 TIOL221

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  Wake-Up Detection
      2. 7.3.2  Current Limit Configuration
        1. 7.3.2.1 Current Limit Configuration in Pin-Mode
        2. 7.3.2.2 Current Limit Configuration in SPI mode
      3. 7.3.3  CQ Current Fault Detection, Indication and Auto Recovery
      4. 7.3.4  DO Current Fault Detection, Indication and Auto Recovery
      5. 7.3.5  CQ and DI Receivers
      6. 7.3.6  Fault Reporting
        1. 7.3.6.1 Thermal Warning, Thermal Shutdown
      7. 7.3.7  The Integrated Voltage Regulator (LDO)
      8. 7.3.8  Reverse Polarity Protection
      9. 7.3.9  Integrated Surge Protection and Transient Waveform Tolerance
      10. 7.3.10 Undervoltage Lock-Out (UVLO)
      11. 7.3.11 Interrupt Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 CQ and DO Tracking mode
    5. 7.5 SPI Programming
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Driving Capacitive Loads
        2. 8.2.2.2 Driving Inductive Loads
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 TIOL221 Registers
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

5.5 Thermal Information

THERMAL METRIC(1) TIOL221 UNIT
RGE (24 Pins) YAH (25 Pins)
RθJA Junction-to-ambient thermal resistance 32.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.2 °C/W
RθJB Junction-to-board thermal resistance 11.4 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 11.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.