SLLSFY7 November   2025 ISOW6441 , ISOW6442

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics - Power Converter
    10. 5.10 Supply Current Characteristics - Power Converter
    11. 5.11 Electrical Characteristics Channel Isolator - VDD = 5V, VDDL = 5V, VISO=5V
    12. 5.12 Supply Current Characteristics Channel Isolator - VDD, VDDL = 5V, VISO = 5V
    13. 5.13 Electrical Characteristics Channel Isolator - VDD = 5V, VDDL = 5V, VISO=3.3V
    14. 5.14 Supply Current Characteristics Channel Isolator - VDD, VDDL = 5V, VISO = 3.3V
    15. 5.15 Electrical Characteristics Channel Isolator - VDD = 3.3V, VDDL = 3.3V, VISO = 3.3V
    16. 5.16 Supply Current Characteristics Channel Isolator - VDD, VDDL = 3.3V, VISO = 3.3V
    17. 5.17 Electrical Characteristics Channel Isolator - VDDL = 2.5V
    18. 5.18 Supply Current Characteristics Channel Isolator - VDDL = 2.5V
    19. 5.19 Switching Characteristics - VDDL = 5V, VISO = 5V
    20. 5.20 Switching Characteristics - VDDL = 3.3V, VISO = 3.3V
    21. 5.21 Switching Characteristics - VDDL = 2.5V, VISO = 5V
    22. 5.22 Switching Characteristics - VDDL = 2.5V, VISO = 3.3V
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Power Isolation
      2. 7.1.2 Signal Isolation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 7.3.2 Power-Up and Power-Down Behavior
      3. 7.3.3 Protection Features
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information

8.2.2 Detailed Design Procedure

The devices requires specific placement of external bypass capacitors and ferrite beads to operate at high performance. These low-ESR ceramic bypass capacitors must be placed as close to the chip pads as possible.

ISOW6441 ISOW6442 Typical ISOW6441 Circuit Hook-UpFigure 8-2 Typical ISOW6441 Circuit Hook-Up