SLLSFY7 November   2025 ISOW6441 , ISOW6442

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics - Power Converter
    10. 5.10 Supply Current Characteristics - Power Converter
    11. 5.11 Electrical Characteristics Channel Isolator - VDD = 5V, VDDL = 5V, VISO=5V
    12. 5.12 Supply Current Characteristics Channel Isolator - VDD, VDDL = 5V, VISO = 5V
    13. 5.13 Electrical Characteristics Channel Isolator - VDD = 5V, VDDL = 5V, VISO=3.3V
    14. 5.14 Supply Current Characteristics Channel Isolator - VDD, VDDL = 5V, VISO = 3.3V
    15. 5.15 Electrical Characteristics Channel Isolator - VDD = 3.3V, VDDL = 3.3V, VISO = 3.3V
    16. 5.16 Supply Current Characteristics Channel Isolator - VDD, VDDL = 3.3V, VISO = 3.3V
    17. 5.17 Electrical Characteristics Channel Isolator - VDDL = 2.5V
    18. 5.18 Supply Current Characteristics Channel Isolator - VDDL = 2.5V
    19. 5.19 Switching Characteristics - VDDL = 5V, VISO = 5V
    20. 5.20 Switching Characteristics - VDDL = 3.3V, VISO = 3.3V
    21. 5.21 Switching Characteristics - VDDL = 2.5V, VISO = 5V
    22. 5.22 Switching Characteristics - VDDL = 2.5V, VISO = 3.3V
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Power Isolation
      2. 7.1.2 Signal Isolation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 7.3.2 Power-Up and Power-Down Behavior
      3. 7.3.3 Protection Features
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information

5.17 Electrical Characteristics Channel Isolator - VDDL = 2.5V

VDDL= 2.5 V ±10% (over recommended operating conditions, unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Channel Isolation
VITH Input pin rising threshold 0.7 × VSI V
VITL Input pin falling threshold 0.3 × VSI V
VI(HYS) Input pin threshold hysteresis (INx) 0.1 × VSI V
IIL Low level input current VIL = 0 at INx -25 µA
IIH High level input current VIH = VSI(1) at INx 25 µA
VOH High level output voltage IO = –2 mA, see Switching Characteristics Test Circuit and Voltage Waveforms VSO(1) – 0.3 V
VOL Low level output voltage IO = 2 mA, see Switching Characteristics Test Circuit and Voltage Waveforms 0.3 V
CMTI Common mode transient immunity VI = VSI or 0 V, VCM = 1000 V; see Common-Mode Transient Immunity Test Circuit 100 200 kV/µs
Ci Input Capacitance VI = VDDL/ 2 + 0.4×sin(2πft), f = 2MHz, VDDL = 2.5V 2 pF
(1) VSI = input side supply; VSO = output side supply