SLOU567B March   2025  – November 2025 THS3470

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Configuration Details
    1. 2.1 Heat Sink Usage
    2. 2.2 Power Connections
    3. 2.3 Input and Output Connections
    4. 2.4 Output Current Limits
    5. 2.5 Power Control Modes
    6. 2.6 Die Temperature and Output Current Readings
  7. 3Quick Start Instructions
    1. 3.1 Required Equipment for Basic Evaluation
    2. 3.2 Steps for Standard AC or DC Evaluation
    3. 3.3 Using Multiple Power Supplies
    4. 3.4 TI Evaluation Setup Images
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Additional Information
    1. 5.1 Trademarks
  10. 6Revision History

Revision History

Changes from Revision A (October 2025) to Revision B (November 2025)

  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo
  • Changed THS3470EVM to THS3470REBEVMGo

Changes from Revision * (March 2025) to Revision A (October 2025)

  • Updated Bill of MaterialsGo