SLOU567B March   2025  – November 2025 THS3470

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Configuration Details
    1. 2.1 Heat Sink Usage
    2. 2.2 Power Connections
    3. 2.3 Input and Output Connections
    4. 2.4 Output Current Limits
    5. 2.5 Power Control Modes
    6. 2.6 Die Temperature and Output Current Readings
  7. 3Quick Start Instructions
    1. 3.1 Required Equipment for Basic Evaluation
    2. 3.2 Steps for Standard AC or DC Evaluation
    3. 3.3 Using Multiple Power Supplies
    4. 3.4 TI Evaluation Setup Images
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Additional Information
    1. 5.1 Trademarks
  10. 6Revision History

2.2 Power Connections

Ths THS3470REBEVM includes four separate power connections. VCC for the positive supply to the device, VEE for the negative supply to the device, GND to connect the board ground, and an optional VDD connection to set the digital logic high level for the control signals. The typical power configuration is a split supply with a range of VCC/VEE = +12V/-12V to VCC/VEE = +30V/-30V. The VDD jack is disconnected by default as the board logic reference is connected to the parts internal VDD supply. To connect to an external VDD, move the jumper to short pins 1 and 2 of J4. The board can also be operated in single-supply with VEE = GND, but be aware that many of the components to the board are terminated to ground which can introduce a DC load in single-supply conditions.