SLOU567B March   2025  – November 2025 THS3470

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Configuration Details
    1. 2.1 Heat Sink Usage
    2. 2.2 Power Connections
    3. 2.3 Input and Output Connections
    4. 2.4 Output Current Limits
    5. 2.5 Power Control Modes
    6. 2.6 Die Temperature and Output Current Readings
  7. 3Quick Start Instructions
    1. 3.1 Required Equipment for Basic Evaluation
    2. 3.2 Steps for Standard AC or DC Evaluation
    3. 3.3 Using Multiple Power Supplies
    4. 3.4 TI Evaluation Setup Images
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Additional Information
    1. 5.1 Trademarks
  10. 6Revision History

2.6 Die Temperature and Output Current Readings

The THS3470 also features a die temperature output (pins 12 and 13) and a output current monitor (pin 11). The die temperature produces a voltage output proportional to the internal junction temperature of the device to monitor the change in temperature over load conditions. The output current pin produces a current that is 1/2048 of the actual output current of the device.