SLUSF91 December   2025 UCC23710

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power Supplies
      2. 6.3.2  VDD Undervoltage Lockout (UVLO)
      3. 6.3.3  Opto-Emulated Input
      4. 6.3.4  Driver Stage
      5. 6.3.5  Active Pulldown
      6. 6.3.6  Short Circuit Clamping
      7. 6.3.7  Internal Active Miller Clamp
      8. 6.3.8  Desaturation (DESAT) Protection
      9. 6.3.9  Soft Turn Off (STO)
      10. 6.3.10 Fault (FLT) and Reset
    4. 6.4 Device Functional Modes
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Selecting the Input Resistor
        2. 7.2.2.2 Gate Driver Output Resistor
        3. 7.2.2.3 FLT Output
        4. 7.2.2.4 Estimate Gate-Driver Power Loss
        5. 7.2.2.5 Selecting VDD Capacitor
        6. 7.2.2.6 Overcurrent and Short Circuit Protection
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) UCC2371X UNIT
DW (SOIC)
16 Pins
RθJA Junction-to-ambient thermal resistance 73.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.7 °C/W
RθJB Junction-to-board thermal resistance 36.4 °C/W
ΨJT Junction-to-top characterization parameter 18.9 °C/W
ΨJB Junction-to-board characterization parameter 36.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.