SLVAEP5A April   2020  – June 2021 LM3668 , TPS63000 , TPS63000-Q1 , TPS63001 , TPS63002 , TPS63010 , TPS63011 , TPS63020 , TPS63020-Q1 , TPS63021 , TPS63024 , TPS630241 , TPS630242 , TPS630250 , TPS630251 , TPS630252 , TPS63027 , TPS63030 , TPS63031 , TPS63036 , TPS63050 , TPS63051 , TPS63060 , TPS63061 , TPS63070 , TPS63802 , TPS63805 , TPS63806 , TPS63810 , TPS63811 , TPS63900 , TPS63901

 

  1.   Trademarks
  2. 1Introduction
  3. 2EMI Sources
  4. 3Device Optimization
  5. 4Migration from two-layer to four-layer board
  6. 5Additional Capacitors to a Chassis Ground
  7. 6Summary
  8. 7References
  9. 8Revision History

1 Introduction

Meeting clearly defined emission standards is a critical requirement for releasing new products to the market. Today however, almost half of these products end up failing the emission standards. These failures translate to significant delay and can quickly increase the final cost of the product. This report illustrates rule-of-thumb solutions for PCB integration of TPS63xxx that can be implemented to improve EMI performance.