SLVAF66 June   2021 DRV3255-Q1 , DRV8300 , DRV8301 , DRV8302 , DRV8303 , DRV8304 , DRV8305 , DRV8305-Q1 , DRV8306 , DRV8307 , DRV8308 , DRV8320 , DRV8320R , DRV8323 , DRV8323R , DRV8340-Q1 , DRV8343-Q1 , DRV8350 , DRV8350F , DRV8350R , DRV8353 , DRV8353F , DRV8353R

 

  1. Introduction to High-Power Motor Applications
    1. 1.1 Effects of a Poorly-Designed High-Power Motor Driver System
    2. 1.2 Example of the High-Power Design Process
  2. Examining a High-Power Motor Drive System at a High Level
    1. 2.1 Anatomy of the Motor Drive Power Stage and How to Troubleshoot
    2. 2.2 Troubleshooting a High-Power System
  3. High-Power Design Through MOSFETs and MOSFET Gate Current (IDRIVE)
    1. 3.1 MOSFET Gate Current
      1. 3.1.1 How Gate Current Causes Damage
      2. 3.1.2 Gate Resistors and Smart Gate Drive Technology
        1. 3.1.2.1 Gate Resistors
        2. 3.1.2.2 Smart Gate Drive and Internally-Controlled Sink and Source Gate Currents
        3. 3.1.2.3 Summary for Gate Resistors and Smart Gate Drive Technology
      3. 3.1.3 Example Gate Current Calculation for a Given FET
  4. High-Power Design Through External Components
    1. 4.1 Bulk and Decoupling Capacitors
      1. 4.1.1 Note on Capacitor Voltage Ratings
    2. 4.2 RC Snubber Circuits
    3. 4.3 High-Side Drain to Low-Side Source Capacitor
    4. 4.4 Gate-to-GND Diodes
  5. High-Power Design Through a Parallel MOSFET Power Stage
  6. High-Power Design Through Protection
    1. 6.1 VDS and VGS Monitoring
      1. 6.1.1 Turning Off the FETs During an Overcurrent, Shoot-Through, or FET Shorting Event
    2. 6.2 Passive Gate-to-Source Pulldown Resistors
    3. 6.3 Power Supply Reverse Polarity or Power Supply Cutoff Protection
  7. High-Power Design Through Motor Control Methods
    1. 7.1 Brake versus Coast
      1. 7.1.1 Algorithm-Based Solutions
      2. 7.1.2 External Circuit Solutions
      3. 7.1.3 Summary of Brake versus Coast
  8. High-Power Design Through Layout
    1. 8.1 What is a Kelvin Connection?
    2. 8.2 General Layout Advice
  9. Conclusion
  10. 10Acknowledgments

High-Power Design Through a Parallel MOSFET Power Stage

To increase the current-conducting capability of a half-bridge circuit, it is common to place multiple MOSFETs in parallel by tying drains, sources, and gates of the MOSFETs together. From a theoretical standpoint, treat these multiple parallel MOSFETs as one single component.

Figure 5-1 Using MOSFETs in Parallel to Achieve Higher Current-Carrying Capability

In reality, no two MOSFETs are ever exactly identical. This means that ultimately, one MOSFET turns on first, and one MOSFET carries more of the current. Minimizing this difference is critical to system operation. The theory and process behind parallel MOSFET design is explained in the Driving Parallel MOSFETs application brief.

There are a few considerations that can be summarized:

  • Add one resistor for each gate of the FETs used in parallel, not one resistor for all of the parallel FETs. Mismatched MOSFET gates will ring against each other without additional impedance between them.
  • Keep FETs physically very close together and with similar or identical layout
  • Keep gate trace unified and of equal thickness, and split them very close to the gates of the FETs
  • Pair GHx with SHx, and GLx with SLx traces that route back to the gate driver so they are similar lengths and widths
  • Source and drain connections should use copper planes, not only traces