SLVSGY2A October   2023  – October 2025 TPS2HCS10-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 Version A Package
    2. 5.2 Pinout - Version A
    3. 5.3 Version B Package
    4. 5.4 Pinout - Version B
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Protection Mechanisms
        1. 8.3.1.1 Overcurrent Protection
          1. 8.3.1.1.1 Inrush Period - Overcurrent Protection
          2. 8.3.1.1.2 Overcurrent Protection - Steady State Operation
          3. 8.3.1.1.3 Programmable Fuse Protection
          4. 8.3.1.1.4 Immediate Shutdown Overcurrent Protection (IOCP)
          5. 8.3.1.1.5 Auto Retry and Latch-Off Behavior
        2. 8.3.1.2 Thermal Shutdown
        3. 8.3.1.3 Reverse Battery
      2. 8.3.2 Diagnostic Mechanisms
        1. 8.3.2.1 Integrated ADC
        2. 8.3.2.2 Digital Current Sense Output
        3. 8.3.2.3 Output Voltage Measurement
        4. 8.3.2.4 MOSFET Temperature Measurement
        5. 8.3.2.5 Drain-to-Source Voltage (VDS) Measurement
        6. 8.3.2.6 VBB Voltage Measurement
        7. 8.3.2.7 VOUT Short-to-Battery and Open-Load
          1. 8.3.2.7.1 Measurement with Channel Output (FET) Enabled
          2. 8.3.2.7.2 Detection with Channel Output Disabled
      3. 8.3.3 Parallel Mode Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 State Diagram
      2. 8.4.2 Output Control
      3. 8.4.3 SPI Mode Operation
      4. 8.4.4 Fault Reporting
      5. 8.4.5 SLEEP
      6. 8.4.6 CONFIG/ACTIVE
      7. 8.4.7 LIMP_HOME State (Version A only)
      8. 8.4.8 Battery Supply Input (VBB) Under-Voltage
      9. 8.4.9 LOW POWER MODE (LPM) States
        1. 8.4.9.1 MANUAL_LPM State
        2. 8.4.9.2 AUTO_LPM State
    5. 8.5 TPS2HCS10-Q1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Thermal Considerations
        2. 9.2.2.2 Configuring the Capacitive Charging Mode
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5.2 Pinout - Version A

Pin Type Description
No. Name
1 GND GND Device ground
2 SNS O SNS current output – use a parallel RC network to the GND pin of the IC.
3 VDD Power Logic Supply Input – closely decouple to GND pin of the IC with a ceramic capacitor.
4 DI I Sets the output behavior in the LIMP HOME mode, if configured as such.The pin needs to be connected to MCU  or other HI/LO source through a 10K resistor tor protection and enabling the reverse polarity FET turn-on function.
5 LHI  I External input (active High) to enable LIMP HOME mode.
6,7,8 VOUT1 O Output of channel 1
9,10,11 VOUT2 O Output of channel 2
12 FLT / WAKE_SIG O Fault output – on any (one or more) channel - open drain, pull up with a 4.7K resistor to VDD pin. Also functions as a wake signal to the MCU upon load current demand in key-off mode.
13 SDI  I SPI device (secondary) data input 
14 SDO O SPI Data Output from the device. Internally pulled up to VDD.
15 CSN I Chip select. Internally pulled up to VDD
16 SCLK  I SPI Clock input
Thermal Pad VBB Power Power Supply