SLVSIO7 July   2026 LM5192

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for the Serial Control Bus
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN)
      2. 7.3.2  High-Voltage Bias Supply Regulators (VCC, VDDA)
      3. 7.3.3  Enable (EN)
      4. 7.3.4  Switching Frequency
      5. 7.3.5  Dual Random Spread Spectrum (DRSS)
      6. 7.3.6  Soft Start
      7. 7.3.7  Output Voltage
      8. 7.3.8  Minimum Controllable On-Time
      9. 7.3.9  Dual Loop Architecture
        1. 7.3.9.1 Voltage Loop Error Amplifier
        2. 7.3.9.2 Current Loop Error Amplifier
      10. 7.3.10 Programmable ILIM
      11. 7.3.11 IOUT Monitor
      12. 7.3.12 Cable Drop Compensation
      13. 7.3.13 Slope Compensation
      14. 7.3.14 Shunt Current Sensing
      15. 7.3.15 Hiccup Mode Current Limiting
      16. 7.3.16 Device Configuration (CNFG)
      17. 7.3.17 Pulse Frequency Modulation (PFM) / Synchronization
      18. 7.3.18 Out-of-Audio Operation
      19. 7.3.19 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Ready Mode
      4. 7.4.4 Active Mode
      5. 7.4.5 Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Bus Operation
      2. 7.5.2 Clock Stretching
      3. 7.5.3 Data Transfer Formats
      4. 7.5.4 Single READ from a Defined Register Address
      5. 7.5.5 Sequential READ Starting from a Defined Register Address
      6. 7.5.6 Single WRITE to a Defined Register Address
      7. 7.5.7 Sequential WRITE Starting at a Defined Register Address
  9. 8 LM5192 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Power Train Components
        1. 9.1.1.1 Buck Inductor
        2. 9.1.1.2 Output Capacitors
        3. 9.1.1.3 Input Capacitors
        4. 9.1.1.4 EMI Filter
    2. 9.2 Typical Application
      1. 9.2.1 High Efficiency, Wide Input, 400kHz, Synchronous Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Buck Inductor
          3. 9.2.1.2.3 Current-Sense Resistance
          4. 9.2.1.2.4 Output Capacitors
          5. 9.2.1.2.5 Input Capacitors
          6. 9.2.1.2.6 Compensation Components
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Design and Layout
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
        1. 10.2.1.1 PCB Layout Resources
        2. 10.2.1.2 Thermal Design Resources
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1.1 Thermal Design and Layout

For a DC/DC regulator to be useful over a particular temperature range, the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The device is available in a small 3.5mm × 4.5mm 19-pin QFN integrated circuit package to cover a range of application requirements. Thermal Design and Layout summarizes the thermal metrics of this package.

Numerous vias connected from the thermal pads to the internal and solder-side plane or planes are vital to help dissipation. In a multi-layer PCB design, a solid ground plane is typically placed on the PCB layer below the power components. Not only does this action provide a plane for the power stage currents to flow but this action also represents a thermally conductive path away from the heat generating devices.