SLVSKW2 January   2026 ADS1278QML-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Quality Conformance Inspection
    7. 5.7 Timing Requirements: SPI Format
    8. 5.8 Timing Requirements: Frame-Sync Format
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Sampling Aperture Matching
      2. 6.3.2  Frequency Response
        1. 6.3.2.1 High-Speed, Low-Power, And Low-Speed Modes
        2. 6.3.2.2 High-Resolution Mode
      3. 6.3.3  Phase Response
      4. 6.3.4  Settling Time
      5. 6.3.5  Data Format
      6. 6.3.6  Analog Inputs (AINP, AINN)
      7. 6.3.7  Voltage Reference Inputs (VREFP, VREFN)
      8. 6.3.8  Clock Input (CLK)
      9. 6.3.9  Mode Selection (MODE)
      10. 6.3.10 Synchronization (SYNC)
      11. 6.3.11 Power-Down ( PWDN)
      12. 6.3.12 Format[2:0]
      13. 6.3.13 Serial Interface Protocols
      14. 6.3.14 SPI Serial Interface
        1. 6.3.14.1 SCLK
        2. 6.3.14.2 DRDY/FSYNC (SPI Format)
        3. 6.3.14.3 DOUT
        4. 6.3.14.4 DIN
      15. 6.3.15 Frame-Sync Serial Interface
        1. 6.3.15.1 SCLK
        2. 6.3.15.2 DRDY/FSYNC (Frame-Sync Format)
        3. 6.3.15.3 DOUT
        4. 6.3.15.4 DIN
      16. 6.3.16 DOUT Modes
        1. 6.3.16.1 TDM Mode
        2. 6.3.16.2 TDM Mode, Fixed-Position Data
        3. 6.3.16.3 TDM Mode, Dynamic Position Data
        4. 6.3.16.4 Discrete Data Output Mode
      17. 6.3.17 Daisy-Chaining
      18. 6.3.18 Modulator Output
      19. 6.3.19 Pin Test Using Test[1:0] Inputs
      20. 6.3.20 VCOM Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.