SLYY245 March   2025 DRV7308

 

  1.   1
  2.   Overview
  3.   At a glance
  4.   Introduction
  5.   How package variations meet market demands
  6.   Cost efficiency
  7.   Power efficiency
  8.   Enabling miniature products
  9.   Precision solutions
  10.   High voltage
  11.   Isolation
  12.   Multiple chips in one package
  13.   Reliability testing for packaging
  14.   Space-grade packages
  15.   Conclusion
  16.   Additional resources

Precision solutions

Precision devices such as voltage references or clocks were traditionally housed in costly, low-stress ceramic packages. Today, it’s possible to produce precision devices in more affordable plastic packages such as thin-shrink small outline packages (TSSOPs) while maintaining high levels of precision and performance. Additionally, low-stress molding compounds and buffer layers on top of the silicon further enhance performance. In oscillators, clocks and timing circuits, TI’s bulk acoustic wave (BAW) technology reduces board space while improving timing accuracy at higher frequencies.

Figure 16 highlights a cross-section of a BAW-based clock with low modulus material that decouples package stress to achieve high precision.

Cross-section view of a sensitive clock chip covered in low modulus material with TI’s BAW technology decouples package stress from the silicon circuit, enabling consistent and accurate timing performance over a wide temperature range. Figure 16 Cross-section view of a sensitive clock chip covered in low modulus material with TI’s BAW technology decouples package stress from the silicon circuit, enabling consistent and accurate timing performance over a wide temperature range.