Conclusion

The trend of smaller, more compact design requirements will continue to grow. Advancements in analog packaging enable engineers to integrate more functionality into smaller form factors while maintaining high levels of precision and performance, enhancing user experiences and creating new design possibilities. Energy and computing systems now require devices packaged with specialized mold compounds that can withstand voltages exceeding 650V and maintain efficient operation over long periods of high temperatures, high humidity and large bias voltages. Automotive systems, industrial automation and health care devices rely on more reliable semiconductor solutions in packages that can withstand a range of environmental conditions such as adverse conditions, extreme temperatures, vibrations and electromagnetic interference.

TI’s investments in internal manufacturing and technology have given the company greater control of its entire manufacturing process, while also lowering costs. By optimizing packaging solutions for specific application needs, TI can explore new design approaches and technologies while achieving the highest levels of quality and reliability – driving innovation and meeting changing industry demands.