SLYY245 March   2025 DRV7308

 

  1.   1
  2.   Overview
  3.   At a glance
  4.   Introduction
  5.   How package variations meet market demands
  6.   Cost efficiency
  7.   Power efficiency
  8.   Enabling miniature products
  9.   Precision solutions
  10.   High voltage
  11.   Isolation
  12.   Multiple chips in one package
  13.   Reliability testing for packaging
  14.   Space-grade packages
  15.   Conclusion
  16.   Additional resources

Enabling miniature products

When devices must be exceptionally small or thin for products such as smartphones, hearing aids or camera lenses, wafer chip-scale packages (WCSPs) are the best option. These packages are built directly on the wafer, with the I/O created on the silicon surface. Despite their compact nature, WCSPs such as the tiny current-sense amplifier shown in Figure 15 require enhancements to help ensure reliability. Specialized overcoats protect the chip from mechanical stresses on the PCB, while optimized metallurgy withstands thermal stresses and potential mechanical challenges such as bending and dropping. Read the company blog, The power of packaging to learn how TI helps engineers create smaller designs.

The INA700 current-sense amplifier with EZShunt™ package technology is available in a 1.2mm-by-1.33mm WCSP package, totaling an area of 1.637mm2. The integrated 2mΩ copper leadframe acts as a shunt resistor. Figure 15 The INA700 current-sense amplifier with EZShunt™ package technology is available in a 1.2mm-by-1.33mm WCSP package, totaling an area of 1.637mm2. The integrated 2mΩ copper leadframe acts as a shunt resistor.