At a glance

1 Introduction	This white paper explores industry-standard package types and recent innovations in analog semiconductor chip and module packaging technology, ranging from power-management devices to operational amplifiers and data converters, as well as other analog integrated circuits (ICs).
2 How package variations meet market demands	Understanding the market requirements for reliability, cost-efficiency and supply-chain resilience necessitates a focus on efficient and dependable packaging.
3 Power efficiency	Examining integration at the system, subsystem (board level) and package level (including multiple dies and passive components) illustrates how packaging technology can enhance power efficiency and density.
4 Enabling miniature products	Exploring expected advancements in analog packaging technologies and their potential impact.