SLYY245 March   2025 DRV7308

 

  1.   1
  2.   Overview
  3.   At a glance
  4.   Introduction
  5.   How package variations meet market demands
  6.   Cost efficiency
  7.   Power efficiency
  8.   Enabling miniature products
  9.   Precision solutions
  10.   High voltage
  11.   Isolation
  12.   Multiple chips in one package
  13.   Reliability testing for packaging
  14.   Space-grade packages
  15.   Conclusion
  16.   Additional resources

Reliability testing for packaging

Reliability directly impacts product longevity, performance and overall system cost. TI implements rigorous reliability testing that meets industry standards such as Joint Electron Device Engineering Council (JEDEC), Automotive Electronics Council (AEC) and Qualified Manufacturers List (QML), to deliver quality products that operate consistently for long periods of time in applications such as automotive, factory automation and space.

TI has deep expertise in manufacturing analog products with a diverse range of package technologies, tailored to address the needs of different markets and applications. Whether designing for automotive environments with extreme temperature differences, industrial factory robots or tiny personal electronics, design engineers need IC packages that can withstand environmental stresses. TI develops packages to match strict design and safety requirements, including packages with thermal performance and long-term reliability.

Figure 22 shows several packages undergoing high-temperature operation life testing.

High-temperature testing in process at one of TI’s assembly and test facilities, which includes multiple packages in test sockets on a board for high-temperature operation life. Figure 22 High-temperature testing in process at one of TI’s assembly and test facilities, which includes multiple packages in test sockets on a board for high-temperature operation life.