SLYY245 March   2025 DRV7308

 

  1.   1
  2.   Overview
  3.   At a glance
  4.   Introduction
  5.   How package variations meet market demands
  6.   Cost efficiency
  7.   Power efficiency
  8.   Enabling miniature products
  9.   Precision solutions
  10.   High voltage
  11.   Isolation
  12.   Multiple chips in one package
  13.   Reliability testing for packaging
  14.   Space-grade packages
  15.   Conclusion
  16.   Additional resources

Space-grade packages

Space-grade devices are designed with QML-certified packages, including QML Class V (QML-V) ceramic and QML Class P (QML-P) plastic packages designed to operate in the extreme conditions of space. Figure 23 shows a QML-V ceramic package and QML-P plastic package.

QML packaging capability allows TI to sell analog products for space-grade designs, including QML-V ceramic and QML-P plastic packages. Figure 23 QML packaging capability allows TI to sell analog products for space-grade designs, including QML-V ceramic and QML-P plastic packages.

Radiation-hardening techniques, including extended burn-in testing, and lot-by-lot qualification, enable space-grade components to meet stringent requirements of QML certification. Figure 24 shows how space-grade packages are exposed to radiation for testing.

Radiation-hardened testing of high-reliability packages. Figure 24 Radiation-hardened testing of high-reliability packages.

Understanding how to balance reliability requirements is important when considering which devices and packages will perform the best on the PCB in certain applications. Ultimately, product and packaging tests help TI prepare products for shipment to customers all over the world. Figure 25 shows the final test in TI’s facilities before the company sends products to a product distribution center.

At the final step of packaging, every TI product is tested in preparation for shipment. Figure 25 At the final step of packaging, every TI product is tested in preparation for shipment.