SLYY245 March 2025 DRV7308
Because no single package type meets every electronic device’s design requirements, over the years diverse packaging types evolved to address specific needs such as reliability, electrical performance, thermal performance, cost, supply-chain considerations and size.
For example, reliability requirements differ widely based on application, from simple electronics in a small toy to vital components in automotive braking systems. Industrial implementations require long-lasting ICs, while communication towers in climates like Dubai, Singapore or Alaska need devices that can withstand temperature extremes, humidity and corrosive environments. ICs installed in a spacecraft must survive the shocks of launch and endure radiation in space.
In high-speed communications or high-power applications, the electrical impedance of the package can significantly affect system performance, necessitating optimized connections between the chip and package, as well as between the package and the PCB. While traditional semiconductor devices relied on fine gold wire-bonds (typically 15µm to 50µm in diameter) for these initial connections, modern devices may also employ methods such as copper-wire bonding, ribbon bonding, high-density bonding, copper posts, copper clips, solder bumps and through-silicon vias to address specific electrical impedance requirements.
Let’s take a look at the market requirements that drove the creation of diverse packaging options.