SNAS786C July   2020  – July 2025 CDCE6214-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  EEPROM Characteristics
    6. 5.6  Reference Input, Single-Ended Characteristics
    7. 5.7  Reference Input, Differential Characteristics
    8. 5.8  Reference Input, Crystal Mode Characteristics
    9. 5.9  General-Purpose Input Characteristics
    10. 5.10 Triple Level Input Characteristics
    11. 5.11 Logic Output Characteristics
    12. 5.12 Phase Locked Loop Characteristics
    13. 5.13 Closed-Loop Output Jitter Characteristics
    14. 5.14 Input and Output Isolation
    15. 5.15 Buffer Mode Characteristics
    16. 5.16 PCIe Spread Spectrum Generator
    17. 5.17 LVCMOS Output Characteristics
    18. 5.18 LP-HCSL Output Characteristics
    19. 5.19 LVDS Output Characteristics
    20. 5.20 Output Synchronization Characteristics
    21. 5.21 Power-On Reset Characteristics
    22. 5.22 I2C-Compatible Serial Interface Characteristics
    23. 5.23 Timing Requirements, I2C-Compatible Serial Interface
    24. 5.24 Power Supply Characteristics
    25. 5.25 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Reference Inputs
    2. 6.2 Outputs
    3. 6.3 Serial Interface
    4. 6.4 PSNR Test
    5. 6.5 Clock Interfacing and Termination
      1. 6.5.1 Reference Input
      2. 6.5.2 Outputs
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference Block
        1. 7.3.1.1 Zero Delay Mode, Internal and External Path
      2. 7.3.2 Phase-Locked Loop (PLL)
        1. 7.3.2.1 PLL Configuration and Divider Settings
        2. 7.3.2.2 Spread Spectrum Clocking
        3. 7.3.2.3 Digitally-Controlled Oscillator and Frequency Increment or Decrement - Serial Interface Mode and GPIO Mode
      3. 7.3.3 Clock Distribution
        1. 7.3.3.1 Glitchless Operation
        2. 7.3.3.2 Divider Synchronization
        3. 7.3.3.3 Global and Individual Output Enable
      4. 7.3.4 Power Supplies and Power Management
      5. 7.3.5 Control Pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Modes
        1. 7.4.1.1 Fall-Back Mode
        2. 7.4.1.2 Pin Mode
        3. 7.4.1.3 Serial Interface Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
      2. 7.5.2 EEPROM
        1. 7.5.2.1 EEPROM - Cyclic Redundancy Check
        2. 7.5.2.2 Recommended Programming Procedure
        3. 7.5.2.3 EEPROM Access
          1. 7.5.2.3.1 Register Commit Flow
          2. 7.5.2.3.2 Direct Access Flow
        4. 7.5.2.4 Register Bits to EEPROM Mapping
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Up Sequence
      2. 8.3.2 Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

11.1 Package Option Addendum

Packaging Information

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4)(5)

CDCE6214TWRGERQ1

 ACTIVE VQFN RGE 24 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 105

6214Q1

A2Z
CDCE6214TWRGETQ1 ACTIVE VQFN RGE 24 250 RoHS & Green SN Level-2-260C-1 YEAR

6214Q1

A2Z
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.