SNVSC77B December   2024  – April 2025 LM5125-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Configuration (CFG0-pin, CFG1-pin, CFG2-pin)
      2. 6.3.2  Device and Phase Enable/Disable (UVLO/EN, EN2)
      3. 6.3.3  Switching Frequency and Synchronization (SYNCIN)
      4. 6.3.4  Dual Random Spread Spectrum (DRSS)
      5. 6.3.5  Operation Modes (BYPASS, DEM, FPWM)
      6. 6.3.6  VCC Regulator, BIAS (BIAS-pin, VCC-pin)
      7. 6.3.7  Soft Start (SS-pin)
      8. 6.3.8  VOUT Programming (VOUT, ATRK, DTRK)
      9. 6.3.9  Protections
        1. 6.3.9.1 VOUT Overvoltage Protection (OVP)
        2. 6.3.9.2 Thermal Shutdown (TSD)
      10. 6.3.10 Power-Good Indicator (PGOOD-pin)
      11. 6.3.11 Slope Compensation (CSP1, CSP2, CSN1, CSN2)
      12. 6.3.12 Current Sense Setting and Switch Peak Current Limit (CSP1, CSP2, CSN1, CSN2)
      13. 6.3.13 Input Current Limit and Monitoring (ILIM, IMON, DLY)
      14. 6.3.14 Maximum Duty Cycle and Minimum Controllable On-time Limits
      15. 6.3.15 Signal Deglitch Overview
      16. 6.3.16 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LOx, HOx, HBx-pin)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Feedback Compensation
      2. 7.1.2 Non-synchronous Application
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1  Determine the Total Phase Number
        2. 7.2.3.2  Determining the Duty Cycle
        3. 7.2.3.3  Timing Resistor RT
        4. 7.2.3.4  Inductor Selection Lm
        5. 7.2.3.5  Current Sense Resistor Rcs
        6. 7.2.3.6  Current Sense Filter RCSFP, RCSFN, CCS
        7. 7.2.3.7  Low-Side Power Switch QL
        8. 7.2.3.8  High-Side Power Switch QH
        9. 7.2.3.9  Snubber Components
        10. 7.2.3.10 Vout Programming
        11. 7.2.3.11 Input Current Limit (ILIM/IMON)
        12. 7.2.3.12 UVLO Divider
        13. 7.2.3.13 Soft Start
        14. 7.2.3.14 CFG Settings
        15. 7.2.3.15 Output Capacitor Cout
        16. 7.2.3.16 Input Capacitor Cin
        17. 7.2.3.17 Bootstrap Capacitor
        18. 7.2.3.18 VCC Capacitor CVCC
        19. 7.2.3.19 BIAS Capacitor
        20. 7.2.3.20 VOUT Capacitor
        21. 7.2.3.21 Loop Compensation
      4. 7.2.4 Performance Data and Results
        1. 7.2.4.1 Efficiency
        2. 7.2.4.2 Steady State Waveforms
        3. 7.2.4.3 Step Load Response
        4. 7.2.4.4 AC Loop Response Curve
        5. 7.2.4.5 Thermal Performance
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range (unless otherwise specified)(1)
MIN MAX UNIT
Input(2) BIAS to AGND –0.3 50 V
UVLO/EN to AGND –0.3 BIAS + 0.3
CSPx to AGND –0.3 50
CSPx to CSNx –0.3 0.3
VOUT to AGND -0.3 65
HBx to AGND –0.3 71
HBx to SWx –0.3 5.8(3)
SWx to AGND –0.3 65
SWx to AGND (10ns) –5 65
CFG0, CFG1, CFG2, SYNCIN, ATRK/DTRK, DLY, MODE, EN2 to AGND –0.3 5.5
RT to AGND –0.3 2.5
PGND to AGND –0.3 0.3
Output(2) VCC to AGND –0.3 5.8(3) V
HOx to SWx (50ns) –1 HBx + 0.3
LOx to AGND (50ns) –1 VCC + 0.3
PGOOD, SS, COMP, ILIM/IMON  to AGND –0.3 5.5
Operating junction temperature, TJ(4) –40 150 °C
Storage temperature, TSTG –55 150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) It is not allowed to apply an external voltage directly to CFG0, CFG1, CFG2, COMP, SS, RT, LOx, HOx pins.
(3) Operating lifetime is derated when the pin voltage is greater than 5.5V.
(4) High junction temperatures degrade operating lifetimes. Operating lifetime is derated for junction temperatures greater than 125°C.