SPRAD05B May   2023  – December 2023 AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Before Getting Started With the Board Design
    2. 1.2 Processor Selection
      1. 1.2.1 Note on AM625SIP Data Sheet
      2. 1.2.2 AM625 and AM625SIP Board Design Compatibility
    3. 1.3 Technical Documentation
    4. 1.4 Design Documentation
  5. 2 Block Diagram
    1. 2.1 Constructing the Block Diagram
    2. 2.2 Selecting the Boot Mode
    3. 2.3 Confirming Pinmux (Multiplexing Compatibility)
  6. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power
      2. 3.1.2 Discrete Power
    2. 3.2 Power (Supply) Rails
      1. 3.2.1 Core Supply
      2. 3.2.2 Peripheral Power Supply
      3. 3.2.3 DDR PHY and SDRAM Power Supply
        1. 3.2.3.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
        2. 3.2.3.2 AM625SIP
      4. 3.2.4 Internal LDOs for IO Groups (Processor IO Groups)
      5. 3.2.5 Dual-Voltage IOs (Processor IOs)
      6. 3.2.6 Dual-Voltage Dynamic Switching IOs
      7. 3.2.7 VPP (eFuse ROM programming supply)
    3. 3.3 Determining Board Power Requirements
    4. 3.4 Power Supply Filters
    5. 3.5 Power Supply Decoupling and Bulk Capacitors
      1. 3.5.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 3.5.2 AM625SIP
      3. 3.5.3 Note on PDN target impedance
    6. 3.6 Power Supply Sequencing
    7. 3.7 Supply Diagnostics
    8. 3.8 Power Supply Monitoring
  7. 4 Clocking
    1. 4.1 Processor Clock Inputs
      1. 4.1.1 Unused WKUP_LFOSC0
      2. 4.1.2 LVCMOS Digital Clock Source
      3. 4.1.3 Crystal Selection
    2. 4.2 Clock Outputs
  8. 5 JTAG (Joint Test Action Group)
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
        1. 5.1.1.1 AM625 / AM623
        2. 5.1.1.2 AM625-Q1 / AM620-Q1
        3. 5.1.1.3 AM625SIP
      2. 5.1.2 Implementation of JTAG / Emulation
      3. 5.1.3 Connection of JTAG Interface Signals
  9. 6 Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
    2. 6.2 Latching of Boot Mode Configuration
    3. 6.3 Resetting the Attached Devices
    4. 6.4 Watchdog Timer
  10. 7 Processor Peripherals
    1. 7.1  Selecting Peripherals Across Domains
    2. 7.2  Memory (DDRSS)
      1. 7.2.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
        1. 7.2.1.1 Processor DDR Subsystem and Device Register Configuration
        2. 7.2.1.2 Calibration Resistor Connection
      2. 7.2.2 AM625SIP
        1. 7.2.2.1 Reassigned DDRSS0 Pins on the AMK Package
        2. 7.2.2.2 Calibration Resistors Connection
    3. 7.3  Media and Data Storage Interfaces
    4. 7.4  Ethernet Interface Using Common Platform Ethernet Switch 3-port Gigabit (CPSW3G)
    5. 7.5  Programmable Real-Time Unit Subsystem (PRUSS)
    6. 7.6  Universal Serial Bus (USB) Subsystem
    7. 7.7  General Connectivity Peripherals
    8. 7.8  Display Subsystem (DSS)
      1. 7.8.1 AM625 / AM623 / AM625SIP / AM625-Q1
      2. 7.8.2 AM620-Q1
    9. 7.9  Camera Subsystem (CSI)
    10. 7.10 Connection of Processor Power Pins, Unused Peripherals and IOs
      1. 7.10.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 7.10.2 AM625SIP
      3. 7.10.3 External Interrupt (EXTINTn)
      4. 7.10.4 Reserved Pins (Signals)
  11. 8 Interfacing of Processor IOs ( LVCMOS or Open-Drain or Fail-Safe Type IO Buffers) and Simulations
    1. 8.1 AM625 / AM623
    2. 8.2 AM625-Q1 / AM620-Q1
    3. 8.3 AM625SIP
  12. 9 Power Consumption and Thermal Analysis
    1. 9.1 Power Consumption
    2. 9.2 Maximum Current for Different Supply Rails
    3. 9.3 Power Modes
    4. 9.4 Thermal Design Guidelines
      1. 9.4.1 AM625 / AM623
      2. 9.4.2 AM625-Q1 / AM620-Q1
      3. 9.4.3 AM625SIP
  13. 10Schematic Design, Capture and Review
    1. 10.1 Selection of Components and Values
    2. 10.2 Schematic Design and Capture
    3. 10.3 Schematics Review
  14. 11Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
    1. 11.1 Escape Routing for PCB Design
    2. 11.2 DDR Design and Layout Guidelines
      1. 11.2.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 11.2.2 AM625SIP
    3. 11.3 High-Speed Differential Signal Routing Guidelines
    4. 11.4 Board Layer Count and Stack-up
      1. 11.4.1 AM625 / AM623 / AM625-Q1 / AM620-Q1
      2. 11.4.2 AM625SIP
      3. 11.4.3 Simulation Recommendations
    5. 11.5 Reference for the Steps to be Followed for Running Simulation
  15. 12Device Handling and Assembly
    1. 12.1 Soldering Recommendations
      1. 12.1.1 Additional References
  16. 13References
    1. 13.1 AM625SIP
    2. 13.2 AM625 / AM623
    3. 13.3 AM625-Q1 / AM620-Q1
    4. 13.4 AM625 / AM623 / AM625-Q1 / AM620-Q1
    5. 13.5 Common for all AM62x family of processors
  17. 14Terminology
  18. 15Revision History

3.2.1 Core Supply

Core supplies VDD_CORE, VDDA_CORE_CSIRX0, VDDA_CORE_USB, and VDDA_DDR_PLL0 (only available on the AMC package) are always recommended to be powered by the same power source and can be operated at 0.75 V or 0.85 V. When these supplies are operating at 0.75 V, it is recommended to ramp-up 0.75 V prior to all 0.85 V supplies.

VDDR_CORE is specified to operate only at 0.85 V. When VDD_CORE is configured to operate at 0.85 V, VDD_CORE and VDDR_CORE are recommended to be powered by the same source to ramp-up together.

VDD_CANUART is recommended to be connected to always on power sources when Partial IO (low power) mode is used. It is recommended to connect VDD_CANUART to the same power source as VDD_CORE when Partial IO mode not used.

For more information, see the Recommended Operating Conditions table in the Specifications section of the device-specific data sheet.

Note: For selection of core voltage, see the Operating Performance Points section of the device-specific data sheet.