SPRUJ07 august   2023 TMS320F28075 , TMS320F28075-Q1 , TMS320F28076 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1 , TMS320F28379S , TMS320F28P650DH , TMS320F28P650DK , TMS320F28P650SH , TMS320F28P650SK , TMS320F28P659DH-Q1 , TMS320F28P659DK-Q1 , TMS320F28P659SH-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Feature Differences Between F2837x and F28P65x
    1. 1.1 F2837x and F28P65x Feature Comparison
  5. 2PCB Hardware Changes
    1. 2.1 PCB Hardware Changes for the 176-Pin PTP and 100-Pin PZP Package
    2. 2.2 Use of Existing 176-Pin F2837x PCB Design
      1.      9
      2. 2.2.1 JTAG TRSTn No-Connect
      3. 2.2.2 GPIO Input Buffer Control Register
      4. 2.2.3 176-Pin GPIO Pin/Multiplex and ADCD Considerations
        1. 2.2.3.1 176-Pin PTP Pins with Different GPIO Assignment
        2. 2.2.3.2 ADCD Channel Migration
    3. 2.3 176-Pin PTP New PCB Design
    4. 2.4 100-Pin PZP New PCB Design
    5. 2.5 337-BGA ZWT Application to 256-BGA ZEJ or 169-BGA NMR
  6. 3Feature Differences for System Consideration
    1. 3.1 New Features in F28P65x
      1. 3.1.1 Lock-step Compare Module (LCM)
      2. 3.1.2 Expanded Analog Channels
      3. 3.1.3 Firmware Update (FWU)
      4. 3.1.4 Flexible GPIO and Digital Input Pins
      5. 3.1.5 ADC Hardware Redundancy Safety Checker
      6. 3.1.6 Flexible Memory Sharing between CPU Subsystems
      7. 3.1.7 Increased RAM Program Memory on CLA
    2. 3.2 Communication Module Changes
    3. 3.3 Control Module Changes
    4. 3.4 Analog Module Differences
    5. 3.5 Other Device Changes
      1. 3.5.1 PIE Channel Mapping
        1. 3.5.1.1 F2837x vs F28P65x PIE Channel Mapping Comparison
      2. 3.5.2 Bootrom
      3. 3.5.3 AGPIO Filter
    6. 3.6 Power Management
      1. 3.6.1 VREGENZ
      2. 3.6.2 POR/BOR
      3. 3.6.3 Power Consumption
    7. 3.7 Memory Module Changes
    8. 3.8 GPIO Multiplexing Changes
      1. 3.8.1 F2837x vs F28P65x GPIO Mux Comparison
    9. 3.9 Analog Multiplexing Changes
      1. 3.9.1 F2837x_176PTP vs F28P65x_176PTP Analog Connections Comparison
  7. 4Application Code Migration From F2837x to F28P65x
    1. 4.1 C2000Ware Header Files
    2. 4.2 Linker Command Files
    3. 4.3 C2000Ware Examples
  8. 5EABI Support
    1. 5.1 NoINIT Struct Fix (Linker Command)
    2. 5.2 Pre-Compiled Libraries
  9.   References

3.7 Memory Module Changes

RAM and FLASH memories in F2837x and F28P65x devices have some similarities and differences. Table 3-11 summarizes the memory features including error-checking and security assignment.

Table 3-11 RAM and FLASH Memory Changes
Memory F2837x F28P65x
Size Parity/
ECC		 Secured Size Parity/
ECC		 Secured
RAM Dedicated RAM 24KB ECC 104KB Parity
Local Shared RAM 48KB ECC Yes 64KB Parity
Global Shared RAM 128KB Parity 80KB Parity
CPU1,2 & Message RAM 4KB ECC 4KB Parity
C28 CPUs/CLA Message RAM 1KB Parity 512B Parity
DMA/CLA Message RAM 1KB Parity 512B Parity
Total RAM 206KB 249KB
FLASH Per C28 Bank 256KB(2 banks per CPU x 2 C28 CPUs) ECC DCSM-
controlled		 256KB(5 banks mappable between 2 C28 CPUs) ECC DCSM-
controlled
Total FLASH 1.0MB 1.28MB