TIDUF20B December   2022  – July 2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Configure This Design for Different Use Cases
      2. 2.2.2 Auxiliary Power Strategy
      3. 2.2.3 High-Side N-Channel MOSFET
      4. 2.2.4 Stacked AFE Communication
      5. 2.2.5 Thermistor Multiplexer
      6. 2.2.6 CAN Stacking
    3. 2.3 Highlighted Products
      1. 2.3.1  BQ76972
      2. 2.3.2  MSPM0G3519
      3. 2.3.3  UCC334xx
      4. 2.3.4  LM5168
      5. 2.3.5  ISO1640
      6. 2.3.6  ISO1042
      7. 2.3.7  ISO1410
      8. 2.3.8  TPS7A24
      9. 2.3.9  TMP61
      10. 2.3.10 TPD2E007
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software Requirements
      1. 3.2.1 Getting Started MSPM0 Software
        1. 3.2.1.1 Download and Install Software Required for Board Test
        2. 3.2.1.2 Import the Project Into CCS
        3. 3.2.1.3 Compile the Project
        4. 3.2.1.4 Download Image and Run
      2. 3.2.2 Software Function List
        1. 3.2.2.1 Driverlib Function List
          1.        CAN_ID_Init_on_Startup
          2.        CAN_Write
          3.        CANprocessCANRxMsg
          4.        I2C_WriteReg
          5.        I2C_ReadReg
          6.        RS485_Send
          7.        RS485_Receive
        2. 3.2.2.2 Application Function List
          1.        Temp_Mux_Polling
          2.        BatteryDataUpdate_32s
          3.        BQ769x2_OTP_Programming
          4.        Check_Signal_Pattern
          5.        BMU_FET_Test
      3. 3.2.3 Software Workflow
    3. 3.3 Test Setup
    4. 3.4 Test Results
      1. 3.4.1 Cell Voltage Accuracy
      2. 3.4.2 Pack Current Accuracy
      3. 3.4.3 Auxiliary Power and System Current Consumption
      4. 3.4.4 Protection
      5. 3.4.5 Working Modes Transition
      6. 3.4.6 Thermistor Multiplexer
      7. 3.4.7 ESD Performance
      8. 3.4.8 Surge Immunity
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author
  12. 6Revision History

2.3.5 ISO1640

The ISO1640, ISO1641, ISO1642, ISO1643, and ISO1644 (ISO164x) devices are hot-swappable, low-power, bidirectional isolators that are compatible with I2C interfaces. The ISO164x supports UL 1577 isolation ratings of 5000VRMS in the 16-DW package, and 3000VRMS in the 8-D package. Each I2C isolation channel in this low emissions device has a logic input and open drain output separated by a double capacitive silicon dioxide (SiO2) insulation barrier. The ISO1642 and ISO1643 integrates two unidirectional CMOS isolation channels, while the ISO1644 integrates three unidirectional CMOS isolation channels which can be used for static GPIO isolation or to isolate a Serial Peripheral Interface (SPI) bus. This family includes basic and reinforced insulation devices certified by VDE, UL, CSA, TUV, and CQC. The ISO1640, ISO1642, ISO1643, and ISO1644 have two isolated bidirectional channels for clock and data lines and the ISO1641 has a bidirectional data and a unidirectional clock channel. The ISO164x family integrates logic required to support bidirectional channels, providing a much simpler design and smaller footprint when compared to optocoupler-based designs.