SPRAD61 February   2023 AM2732 , AM2732 , AM2732-Q1 , AM2732-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1 Introduction
    1. 1.1 Acronyms
  4. 2 Power
    1. 2.1 Discrete DC-DC Power Solution
    2. 2.2 Integrated PMIC Power Solution
    3. 2.3 Power Decoupling and Filtering
    4. 2.4 Power Consumption
  5. 3 Clocking
    1. 3.1 Crystal and Oscillator Input Options
    2. 3.2 Output Clock Generation
    3. 3.3 Crystal Selection and Shunt Capacitance
    4. 3.4 Crystal Placement and Routing
  6. 4 Resets
  7. 5 Bootstrapping
    1. 5.1 SOP Signal Implementation
    2. 5.2 QSPI Memory Controller Implementation
    3. 5.3 ROM QSPI Boot Requirements
  8. 6 JTAG Emulators and Trace
  9. 7 Multiplexed Peripherals
  10. 8 Digital Peripherals
    1. 8.1 General Digital Peripheral Routing Guidelines
  11. 9 Layer Stackup
    1. 9.1 TMDS273GPEVM Layer Stackup
      1. 9.1.1 TMDS273GPEVM Key Stackup Features
    2. 9.2 Four Layer ZCE Example Layer Stackup
      1. 9.2.1 ZCE Four Layer Example Key Stackup Features
  12. 10Vias
  13. 11BGA Power Fan-Out and Decoupling Placement
    1. 11.1 Ground Return
      1. 11.1.1 Ground Return - TMDS273GPEVM
      2. 11.1.2 Ground Return - ZCE Four Layer Example
    2. 11.2 1.2 V Core Digital Power
      1. 11.2.1 1.2 V Core Digital Power Key Layout Considerations
        1. 11.2.1.1 1.2V Core Layout - TMDS273GPEVM
        2. 11.2.1.2 1.2V Core Layout - ZCE Four Layer Example
    3. 11.3 3.3 V Digital and Analog Power
      1. 11.3.1 3.3 V Digital and Analog Power Key Layout Considerations
        1. 11.3.1.1 3.3V Digital and Analog Layout - TMDS273GPEVM
        2. 11.3.1.2 3.3V Digital and Analog Layout - ZCE Four Layer Example
    4. 11.4 1.8 V Digital and Analog Power
      1. 11.4.1 1.8 V Digital and Analog Power Key Layout Considerations
        1. 11.4.1.1 1.8V Digital and Analog Layout - TMDS273GPEVM
        2. 11.4.1.2 1.8V Digital and Analog Layout - ZCE Four Layer Example
  14. 12References

Abstract

This application note intends to serve as a guide for hardware designers creating PCB systems based on the AM273x family of MCU devices. This document serves to integrate device-specific schematic and PCB layout recommendations and examples from the AM273x evaluation modules (EVM), the TMDS273GPEVM, with the AM273x Sitara™ Microcontroller Data Sheet, AM273x Sitara™ Microcontroller Technical Reference Manual and other collateral documents and tools, as shown in GUID-36175247-453D-456C-9EDC-3B7DC3C138F8.html.

Project collateral and source code discussed in this application note can be downloaded from the following link https://www.ti.com/lit/zip/sprad61.