ADC12D1620QML-SP

ACTIVE

Product details

Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2400 Features Ultra High Speed Rating Space Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 59.8 ENOB (Bits) 9.5 SFDR (dB) 67.4 Operating temperature range (°C) -55 to 125 Input buffer Yes Radiation, TID (typ) (krad) 300 Radiation, SEL (MeV·cm2/mg) 120
Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2400 Features Ultra High Speed Rating Space Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 59.8 ENOB (Bits) 9.5 SFDR (dB) 67.4 Operating temperature range (°C) -55 to 125 Input buffer Yes Radiation, TID (typ) (krad) 300 Radiation, SEL (MeV·cm2/mg) 120
CLGA (FVA) 256 780.6436 mm² (0 mm × 0 mm) CCGA (NAA) 376 780.6436 mm² (0 mm × 0 mm)
  • Total ionizing dose (TID) to 300 krad(Si)
  • Single event functional interrupt (SEFI) tested
  • Single event latch-up (SEL) > 120 MeV-cm2/mg
  • Cold sparing capable
  • Wide temperature range –55°C to +125°C
  • Power consumption = 3.8 W or 2.7 W (1600- or 800-MHz clock)
  • 3-dB Input bandwidth = 3 GHz
  • Low-sampling power-saving mode (LSPSM) reduces power consumption and improves performance for fCLK ≤ 800 MHz
  • Auto-sync function for multi-chip systems
  • Time stamp feature to capture external trigger
  • Test patterns at output for system debug
  • 1:1 Non-demuxed or 1:2 or 1:4 parallel demuxed LVDS outputs
  • Single 1.9-V power supply
  • Total ionizing dose (TID) to 300 krad(Si)
  • Single event functional interrupt (SEFI) tested
  • Single event latch-up (SEL) > 120 MeV-cm2/mg
  • Cold sparing capable
  • Wide temperature range –55°C to +125°C
  • Power consumption = 3.8 W or 2.7 W (1600- or 800-MHz clock)
  • 3-dB Input bandwidth = 3 GHz
  • Low-sampling power-saving mode (LSPSM) reduces power consumption and improves performance for fCLK ≤ 800 MHz
  • Auto-sync function for multi-chip systems
  • Time stamp feature to capture external trigger
  • Test patterns at output for system debug
  • 1:1 Non-demuxed or 1:2 or 1:4 parallel demuxed LVDS outputs
  • Single 1.9-V power supply

The ADC12D1620QML uses a package redesign to achieve better ENOB, SNR, and X-talk compared to the ADC12D1600QML. As is its predecessor, the ADC12D1620QML is a low-power, high-performance CMOS analog-to-digital converter (ADC) that digitizes signals at a 12-bit resolution at sampling rates up to 3.2 GSPS in an interleaved mode. It can also be used as a dual-channel ADC for sampling rates up to 1.6 GSPS. For sampling rates below 800 MHz, there is a low-sampling power-saving mode (LSPSM) that reduces power consumption to less than 1.4 W per channel (typical). The ADC can support conversion rates as low as 200 MSPS.

The ADC12D1620QML uses a package redesign to achieve better ENOB, SNR, and X-talk compared to the ADC12D1600QML. As is its predecessor, the ADC12D1620QML is a low-power, high-performance CMOS analog-to-digital converter (ADC) that digitizes signals at a 12-bit resolution at sampling rates up to 3.2 GSPS in an interleaved mode. It can also be used as a dual-channel ADC for sampling rates up to 1.6 GSPS. For sampling rates below 800 MHz, there is a low-sampling power-saving mode (LSPSM) that reduces power consumption to less than 1.4 W per channel (typical). The ADC can support conversion rates as low as 200 MSPS.

Download View video with transcript Video

Technical documentation

No results found. Please clear your search and try again.
View all 12
Top documentation Type Title Format options Date
* Data sheet ADC12D1620QML-SP 12-Bit, Single Or Dual, 3200- or 1600-MSPS RF Sampling Analog-to-Digital Converter (ADC) datasheet (Rev. A) PDF | HTML Oct 12, 2021
* Radiation & reliability report ADC12D1600QML-SP/ADC12D1620QML-SP Single-Event Effects (SEE) Radiation Report Jul 27, 2020
* Radiation & reliability report Single Event Effects Characterization of Texas Instruments ADC12D1600CCMLS Jun 14, 2018
* Radiation & reliability report ADC12D1600CCMLS TID Report Jan 17, 2013
* Radiation & reliability report Analysis of Low Dose Rate Effects on Parasitic Bipolar Structures in CMOS Proces May 4, 2012
Selection guide TI Space Products (Rev. L) Mar 27, 2026
Application brief DLA Approved Optimizations for QML Products (Rev. C) PDF | HTML Jun 17, 2025
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. B) PDF | HTML Jun 10, 2025
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) Feb 20, 2025
Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML Oct 19, 2022
Application brief Understanding Op Amp Noise in Audio Circuits PDF | HTML Jun 14, 2021
User guide ADC1xD1x00CVAL Board User’s Guide Jun 9, 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TSW12D1620EVM-CVAL — ADC12D1620QML-SP evaluation module for 300-krad, 12-bit, dual 1.6-GSPS or single 3.2-GSPS ADC

The TSW12D1620EVM-CVAL is a 1.5-GHz wideband receiver evaluation module (EVM) that includes ceramic engineering models of the amplifier, analog-to-digital converter (ADC), clocking, temperature sensor, microcontroller, and power solution. The board is best suited for (...)

User guide: PDF
Supported products & hardware
In stock
Limit:
??asset.out-of-stock-ti_en_US??
Not available
Firmware

SBAC235 — MSP430FR5969 Firmware

Supported products & hardware
Reference design

TIDA-070004 — Space-grade reference design using integrated digital-output temperature sensor

This reference design illustrates the fact that several spacecraft projects provide a system health status telemetry that ground personnel monitor in real time. This reference design shows an example using a digital output temperature sensor to acquire temperature data on a sub-system using a (...)
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
CLGA (FVA) 256 Ultra Librarian
CCGA (NAA) 376 Ultra Librarian

Ordering & quality

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos