2.95V to 6V, 2A Step-Down Power Module in 9x11x2.8mm QFN Package
Product details
Parameters
Package | Pins | Size
Features
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - 9 mm × 11 mm × 2.8 mm package
- Pin Compatible with LMZ30604 and LMZ30606 - Efficiencies Up To 96%
- Wide-Output Voltage Adjust
0.8 V to 3.6 V, with ±1% Reference Accuracy - Adjustable Switching Frequency
(500 kHz to 2 MHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 12°C/W
- Meets EN55022 Class B Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ30602 With the WEBENCH® Power Designer
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Description
The LMZ30602 power module is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.
The LMZ30602 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
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Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | LMZ30602 2-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) | Apr. 11, 2018 |
| Application note | Soldering Requirements for BQFN Packages (Rev. C) | Mar. 05, 2020 | |
| Selection guide | Innovative DC/DC Power Modules Selection Guide (Rev. C) | Feb. 27, 2018 | |
| White paper | Simplify low EMI design with power modules | Nov. 20, 2017 | |
| Application note | Working With QFN Power Modules (Rev. A) | Jun. 08, 2017 | |
| User guide | Using the LMZ30606EVM-003, LMZ30604EVM-001, LMZ30602EVM-002 (Rev. A) | Mar. 06, 2014 | |
| Application note | Adjusting LMZ3 Output Voltage with LM10010/1 | Feb. 11, 2014 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
LMZ30606EVM-003
Description
The LMZ30606EVM-003 is a fully assembled and tested circuit for evaluating the LMZ30606. The output voltage can be selected from four preset values using a jumper (3.3V, 2.5V, 1.8V, 1.2V, and 0.8V) and has an adjustable switching frequency of 500 kHz to 1 MHz. Solder pads and jumpers are available (...)
Features
- Compatible with 3.3V and 5V input bus applications
- 0.8V internal voltage reference ±1% accurate over temperature
- Adjustable slow start and power sequencing
- Adjustable input voltage UVLO
- Output under-voltage and overvoltage power good output
- Cycle by cycle current limit, frequency foldback, and thermal (...)
Design tools & simulation
SNVM516.ZIP (101 KB) - PSpice Model
SNVM792.ZIP (7 KB) - PSpice Model
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
TIDA-010011 — This reference design showcases various power architectures for generating multiple voltage rails for an application processor module, requiring >1A load current and high efficiency . The required power supply is generated using 5-, 12- or 24-V DC input from the backplane. Power supplies are (...)
Design files
-
download TIDA-010011 BOM.pdf (134KB) -
download TIDA-010011 Assembly Drawing.pdf (1564KB) -
download TIDA-010011 PCB.pdf (4603KB) -
download TIDA-010011 CAD Files.zip (7015KB) -
download TIDA-010011 Gerber.zip (799KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| B1QFN (RKG) | 39 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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