Product details

Number of channels (#) 1 Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock Frequency (Max) (MHz) 150 IOL (Max) (mA) 32 IOH (Max) (mA) -32 ICC (Max) (uA) 10 Features Balanced outputs
Number of channels (#) 1 Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock Frequency (Max) (MHz) 150 IOL (Max) (mA) 32 IOH (Max) (mA) -32 ICC (Max) (uA) 10 Features Balanced outputs
DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 5 2 mm² 1.65 x 1.2 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1
  • Available in the Texas Instruments
    NanoFree™ Package
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Max tpd of 6 ns at 3.3 V and 50 pF load
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff supports Partial-Power-Down Mode and Back-Drive Protection
  • Available in the Texas Instruments
    NanoFree™ Package
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Max tpd of 6 ns at 3.3 V and 50 pF load
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff supports Partial-Power-Down Mode and Back-Drive Protection

The SN74LVC1G79 device is a single positive-edge-triggered D-type flip-flop that is designed for 1.65-V to 5.5-V VCC operation.

When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the level at the output.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

The SN74LVC1G79 device is a single positive-edge-triggered D-type flip-flop that is designed for 1.65-V to 5.5-V VCC operation.

When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the level at the output.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 29
Type Title Date
* Data sheet SN74LVC1G79 Single Positive-Edge-Triggered D-Type Flip-Flop datasheet (Rev. U) 07 Apr 2017
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
Application note Power-Up Behavior of Clocked Devices (Rev. A) 06 Feb 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic EVM supporting 5 through 8 pin DCK, DCT, DCU, DRL, and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
In stock
Limit: 5
Simulation model

SN74LVC1G79 IBIS Model

SCEM367.ZIP (46 KB) - IBIS Model
Package Pins Download
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos