44-V, latch-up immune, 2:1 (SPDT) precision switch with 1.8-V logic
Product details
Parameters
Package | Pins | Size
Features
- Latch-Up Immune
- Dual Supply Range: ±4.5 V to ±22 V
- Single Supply Range: 4.5 V to 44 V
- Low On-Resistance: 2.1 Ω
- Low Charge Injection: -10 pC
- High Current Support: 330 mA (Maximum)
- –40°C to +125°C Operating Temperature
- 1.8 V Logic Compatible
- Fail-Safe Logic
- Rail to Rail Operation
- Bidirectional Signal Path
- Break-Before-Make Switching
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Description
The TMUX7219 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a single channel, 2:1 (SPDT) configuration. The device works with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7219 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
The TMUX7219 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
Same functionality and pinout but is not an equivalent to the compared device:
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX7219 44-V, Latch-Up Immune, 2:1 (SPDT) Precision Switch with 1.8-V Logic datasheet (Rev. C) | Dec. 12, 2020 |
Application note | Dynamically Controlling Signal in a CWD Receive Path for Ultrasound | Jan. 18, 2021 | |
More literature | TMUX72XXDGKEVM EU RoHS Declaration of Conformity (DoC) | Dec. 18, 2020 | |
User guide | TMUX72XXDGKEVM Evaluation Module | Dec. 10, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
The TMUX72XXDGKEVM supports evaluation of the TMUX72xx devices in the 8-pin VSSOP (DGK) package including TMUX7219DGK. This evaluation module can be used for quick prototyping and testing of the TMUX72xx devices specifically for DC parameters.
Features
- Quick prototyping and testing setup for the 8-pin TMUX72xx devices in the VSSOP (DGK) package, including TMUX7219DGK
- Support for both single supply and dual supply operation
- Six power supply decoupling capacitors (2 × 0.1 μF, 2 × 1 μF, and 2 × 10 μF)
- Jumpers to three possible signal lanes, both VDD and (...)
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
VSSOP (DGK) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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