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TPSM53603

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36-V, 3-A step-down power module in small 5.5 x 5 x 4-mm Enhanced HotRod™ QFN with simple footprint

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Product details

Parameters

Iout (Max) (A) 3 Vin (Min) (V) 3.8 Vin (Max) (V) 36 Vout (Min) (V) 1 Vout (Max) (V) 7 Soft start Fixed Features EMI Tested, Enable, Light Load Efficiency, Power Good Operating temperature range (C) -40 to 125 Iq (Typ) (uA) 24 Regulated outputs (#) 1 Switching frequency (Typ) (kHz) 1400 Duty cycle (Max) (%) 98 Topology Buck, Inverting Buck-Boost, Synchronous Buck open-in-new Find other Buck modules (integrated inductor)

Package | Pins | Size

B3QFN (RDA) 15 28 mm² 5 x 5 open-in-new Find other Buck modules (integrated inductor)

Features

  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • Industry’s smallest 36-V, 3-A footprint: 85-mm2 solution size (single-sided)
    • Low EMI: Meets CISPR11 radiated emissions
    • Excellent thermal performance: Up to 18 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, overtemperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 4-A TPSM53604 and 2-A TPSM53602
  • Create a custom design using the TPSM53603 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design

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open-in-new Find other Buck modules (integrated inductor)

Description

The TPSM53603 power module is a highly integrated 3-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53603 an excellent device for powering a wide range of applications.

open-in-new Find other Buck modules (integrated inductor)
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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet TPSM53603 36-V Input, 3-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. A) Aug. 13, 2020
Application note Bang for your Buck-An Intro to Buck Converter vs. Buck Power Module Comparison Aug. 28, 2020
Application note Soldering Requirements for BQFN Packages (Rev. C) Mar. 05, 2020
User guide Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) Dec. 13, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
49
Description
The TPSM53603 evaluation board (EVM) is configured to evaluate the operation of the TPSM53603 power module for current up to 3 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53603 operation.
Features
  • 3.8-V to 36-V input voltage range
  • Up to 3 A of output current
  • 1-V to 7-V output voltage
  • 5 mm x 5.5 mm QFN package

Design tools & simulation

SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

CAD/CAE symbols

Package Pins Download
B3QFN (RDA) 15 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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