0.4-Ω, 3.3-V, 2:1 (SPDT), 4-channel analog switch
Product details
Parameters
Package | Pins | Size
Features
- Specified Break-Before-Make Switching
- Low ON-State Resistance (<0.5 Ω)
- Control Inputs Are 1.8-V Logic Compatible
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 1.65-V to 4.3-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II - ESD Performance Tested Per JESD 22
- ±2000-V Human-Body Model
(A114-B, Class II) - ±1000-V Charged-Device Model
(C101)
- ±2000-V Human-Body Model
Description
The TS3A44159 is a bidirectional 4-channel single-pole double-throw (SPDT) analog switch with two control inputs, which is designed to operate from 1.65 V to 4.3 V. This device is also known as a 2 channel double-pole double-throw (DPDT) configuration. It offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature that prevents signal distortion during the transferring of a signal from one channel to another. The device has an excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TS3A44159 0.45-Ω Quad SPDT Analog Switch 4-Channel 2:1 Multiplexer – Demultiplexer With Two Controls datasheet (Rev. B) | Jan. 21, 2015 |
Application note | CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. A) | Jun. 30, 2020 | |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | 1.8 V Logic for Muxes and Signal | May 16, 2018 | |
White paper | Selecting signal switches to enable IoT communication modules | Mar. 20, 2017 | |
Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 | |
Application note | CBT-C, CB3T, and CB3Q Signal-Switch Families | Feb. 04, 2003 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Reference designs
Design files
-
download TIDA-00586 BOM.pdf (51KB) -
download TIDA-00586 Altium.zip (1392KB) -
download TIDA-00586 Gerber.zip (372KB)
Design files
-
download TIDA-00587 BOM.pdf (53KB) -
download TIDA-00587 Altium.zip (1859KB) -
download TIDA-00587 Gerber.zip (413KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
UQFN (RSV) | 16 | View options |
VQFN (RGT) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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