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TS3A44159

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0.4-Ω, 3.3-V, 2:1 (SPDT), 4-channel analog switch

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0.4-Ω, 3.3-V, 2:1 (SPDT), 4-channel analog switch

TS3A44159

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 4 Power supply voltage - single (V) 1.8, 2.5, 3.3 Ron (Typ) (Ohms) 0.3 ON-state leakage current (Max) (µA) 0.05 Bandwidth (MHz) 35 Operating temperature range (C) -40 to 85 Features Break-before-make, 1.8-V compatible control inputs Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 162 Supply current (Typ) (uA) 0 open-in-new Find other Analog switches & muxes

Package | Pins | Size

TSSOP (PW) 16 22 mm² 4.4 x 5 UQFN (RSV) 16 5 mm² 2.6 x 1.8 VQFN (RGT) 16 9 mm² 3 x 3 open-in-new Find other Analog switches & muxes

Features

  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (<0.5 Ω)
  • Control Inputs Are 1.8-V Logic Compatible
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 4.3-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • ±2000-V Human-Body Model
      (A114-B, Class II)
    • ±1000-V Charged-Device Model
      (C101)
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Description

The TS3A44159 is a bidirectional 4-channel single-pole double-throw (SPDT) analog switch with two control inputs, which is designed to operate from 1.65 V to 4.3 V. This device is also known as a 2 channel double-pole double-throw (DPDT) configuration. It offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature that prevents signal distortion during the transferring of a signal from one channel to another. The device has an excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 9
Type Title Date
* Datasheet TS3A44159 0.45-Ω Quad SPDT Analog Switch 4-Channel 2:1 Multiplexer – Demultiplexer With Two Controls datasheet (Rev. B) Jan. 21, 2015
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. A) Jun. 30, 2020
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note 1.8 V Logic for Muxes and Signal May 16, 2018
White paper Selecting signal switches to enable IoT communication modules Mar. 20, 2017
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families Feb. 04, 2003

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


View details
INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel
View details

Reference designs

REFERENCE DESIGNS Download
Gauge Booster Pack Reference Design
TIDA-00586 — The TIDA-00586 reference design is a gauge that has been designed as a booster pack to fit on the TI Launchpad development boards. The use of this this board for development will reduce the time spent in design and test of the bq27421 gauge IC. You can select any appropriate charger to charge your (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Charger Booster Pack Reference Design
TIDA-00587 — The TIDA-00587 reference design is a charger that has been designed as a booster pack to fit on the TI Launchpad development boards. The use of this this board for development will reduce the time spent in design and test of the bq24250 charger IC. You can charger your battery and using the on board (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
TSSOP (PW) 16 View options
UQFN (RSV) 16 View options
VQFN (RGT) 16 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Qualification summary
  • Ongoing reliability monitoring

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