TS5A23167

ACTIVE

0.9-Ω, 5-V, 1:1 (SPST), 2-channel analog switch (active low)

Top

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 0.75 ON-state leakage current (Max) (µA) 0.02 Bandwidth (MHz) 150 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports I2C signals Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 35.5 Supply current (Typ) (uA) 0.0055 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches & muxes

Features

  • Isolation in Powered-Off Mode, V+ = 0
  • Low ON-State Resistance (0.9 Ω)
  • Control Inputs Are 5.5-V Tolerant
  • Low Charge Injection
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model(A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

All trademarks are the property of their respective owners.

open-in-new Find other Analog switches & muxes

Description

The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

open-in-new Find other Analog switches & muxes
Download
Similar products you might be interested in
open-in-new Compare products
Exact equivalent in functionality and parametrics to the compared device:
TS5A21366 ACTIVE 0.75-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with 1.8-V input logic Upgraded 1.8-V logic support with flipped logic polarity (normally open)
TS5A23166 ACTIVE 0.9-Ω, 5-V, 1:1 (SPST), 2-channel analog switch (active high) Flipped logic polarity (normally open)

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 7
Type Title Date
* Datasheet TS5A23167 0.9-Ω dual SPST analog switch 5-V, 3.3-V 2-channel analog switch datasheet (Rev. C) Mar. 15, 2019
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Application note 1.8 V Logic for Muxes and Signal May 16, 2018
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos

Related videos