0.9-Ω, 5-V, 1:1 (SPST), 2-channel analog switch (active low)
Product details
Parameters
Package | Pins | Size
Features
- Isolation in Powered-Off Mode, V+ = 0
- Low ON-State Resistance (0.9 Ω)
- Control Inputs Are 5.5-V Tolerant
- Low Charge Injection
- Low Total Harmonic Distortion (THD)
- 1.65-V to 5.5-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model(A114-B, Class II)
- 1000-V Charged-Device Model (C101)
All trademarks are the property of their respective owners.
Description
The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.
Exact equivalent in functionality and parametrics to the compared device:
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TS5A23167 0.9-Ω dual SPST analog switch 5-V, 3.3-V 2-channel analog switch datasheet (Rev. C) | Mar. 15, 2019 |
| Application notes | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
| Application notes | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
| Technical articles | Roll with the design punches and overcome power-sequencing challenges | Jul. 29, 2019 | |
| Application notes | Eliminate power Sequencing with powered-off protection signal switches (Rev. B) | Jan. 15, 2019 | |
| Technical articles | Is charge injection causing output voltage errors in your industrial control system? | Oct. 18, 2018 | |
| Application notes | 1.8 V Logic for Muxes and Signal | May 16, 2018 | |
| Application notes | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
| Application notes | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| DSBGA (YZP) | 8 | View options |
| VSSOP (DCU) | 8 | View options |
Ordering & quality
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.