Gehäuseinformationen
| Gehäuse | Pins NFBGA (NZC) | 64 |
| Betriebstemperaturbereich (°C) -10 to 70 |
| Gehäusemenge | Träger 2.000 | LARGE T&R |
Merkmale von DS90CF386
- 20-MHz to 85-MHz Shift Clock Support
- Rx Power Consumption <142 mW (Typical) at
85-MHz Grayscale - Rx Power-Down Mode <1.44 mW (Maximum)
- ESD Rating >7 kV (HBM), >700 V (EIAJ)
- Supports VGA, SVGA, XGA, and Single Pixel
SXGA - PLL Requires No External Components
- Compatible With TIA/EIA-644 LVDS Standard
- Low Profile 56-Pin or 48-Pin TSSOP Package
- DS90CF386 Also Available in a 64-Pin, 0.8-mm,
Fine Pitch Ball Grid Array (NFBGA) Package
Beschreibung von DS90CF386
The DS90CF386 receiver converts four LVDS (Low Voltage Differential Signaling) data streams back into parallel 28 bits of LVCMOS data. Also available is the DS90CF366 receiver that converts three LVDS data streams back into parallel 21 bits of LVCMOS data. The outputs of both receivers strobe on the falling edge. A rising edge or falling edge strobe transmitter will interoperate with a falling edge strobe receiver without any translation logic.
The receiver LVDS clock operates at rates from 20 MHz to 85 MHz. The device phase-locks to the input LVDS clock, samples the serial bit streams at the LVDS data lines, and converts them into parallel output data. At an incoming clock rate of 85 MHz, each LVDS input line is running at a bit rate of 595 Mbps, resulting in a maximum throughput of 2.38 Gbps for the DS90CF386 and 1.785 Gbps for the DS90CF366.
The use of these serial link devices is ideal for solving EMI and cable size problems associated with transmitting data over wide, high-speed parallel LVCMOS interfaces. Both devices are offered in TSSOP packages. The DS90CF386 is also offered in a 64-pin, 0.8-mm, fine pitch ball grid array (NFBGA) package which provides a 44% reduction in PCB footprint compared to the 56-pin TSSOP package.